In our continuing strategy to deliver unparalleled circuit protection solutions,

technical expertise and application leadership, we proudly introduce the

WICKMANN Group and its products to the Littelfuse portfolio.

040606

www.littelfuse.com

Dimensions (mm)

Solder pad Layout (mm)

3.4

2.0

2.0

4.6

Specifications

Packaging

A

Blistertape and reel Ø 178 mm

Materials

Terminals:

TF: Lead free plating

Max. Device Surface Temperature in Tripped State

125 °C

Operating / Storage Temperature

-40 ºC to +85 ºC (consider derating)

Humidity Ageing

+85 °C, 85 % R.H., 1000 hours, ± 5 % typical

resistance change

Vibration

MIL-STD-883C, Method 2007.1, Condition A,

no change

Thermal Shock

MIL-STD-202F, Method 107G

+85 °C to -40 °C 20 times, -30 % typical resistance

change

Solderability

Meets EIA Specification RS186-9E,

ANSI/J-STD-002, Category 3

Reflow only

Solvent Resistance

MIL-STD-202, Method 215, no change

Marking

“P”, Part Code

SMD Type, 6 V - 60 V

Standard

CSA C22.2 No. 0 CSA TIL No. CA-3A

Approvals

cULus Recognition

TÜV

Features

These devices offer a wide range of hold currents

from 0.3 A to 2.0 A and voltages form 6 V to

60 V. The SMD2016 product line is suitable for high

density circuit board applications in computers,

telecommunications and general electronics.

Suitable for relow soldering.

SMD2016

Dimensions (mm)

Model

A

B

C

D

E

packaging quantity

Min Max

Min Max

Min Max

Min

Min Max

tape

SMD2016P030TF

4.72

5.44

3.70

4.43

0.75

1.25

0.30

0.25

0.65

1,500

SMD2016P050TF

4.72

5.44

3.70

4.43

1.20

2.00

0.30

0.25

0.65

1,500

SMD2016P100TF

4.72

5.44

3.70

4.43

0.50

0.75

0.30

0.25

0.65

2,000

SMD2016P100TF/33

4.72

5.44

3.70

4.43

0.75

1.25

0.30

0.25

0.65

1,500

SMD2016P150TF

4.72

5.44

3.70

4.43

0.75

1.55

0.30

0.25

0.65

1,500

SMD2016P200TF

4.72

5.44

3.70

4.43

0.50

0.75

0.30

0.25

0.65

2,000

SMD2016P030TF

0.30

0.60

60

20

3.00 @ 1.50

1.4

0.500

1.400

2.300

•

•

SMD2016P050TF

0.55

1.10

60

20

5.00 @ 2.50

1.4

0.200

0.700

1.000

•

•

SMD2016P100TF

1.10

2.20

15

40

0.50 @ 8.00

1.4

0.100

0.250

0.400

•

•

SMD2016P100TF/33

1.10

2.20

33

40

0.50 @ 8.00

1.4

0.100

0.250

0.400

•

•

SMD2016P150TF

1.50

3.00

15

40

1.00 @ 8.00

1.4

0.070

0.130

0.180

•

•

SMD2016P200TF

2.00

4.20

6

40

3.00 @ 8.00

1.4

0.048

0.070

0.100

•

•

Permissible continuous operating current is ≤ 100 % at ambient temperature of 20 ºC (68 ºF).

NOTE:

I

Hold current: maximum current device will pass without tripping in 20 °C still air.

I

Trip current: minimum current at which the device will trip in 20 °C still air.

V

Maximum voltage device can withstand without damage at rated current (I

I

Maximum fault current device can withstand without damage at rated voltage (V

P

Power dissipated from device when in the tripped state at 20 °C still air.

R

Minimum resistance of device in initial (un-soldered) state.

R

Maximum resistance of device at 20 °C measured one hour after tripping for 20 s.

Caution: Operation beyond the specified rating may result in damage and possible arcing and flame.

Specifications are subject to change without notice

Model

I

hold

I

Trip

V

max. dc

I

max.

max. time to trip

P

d max.

Resistance

Approvals

(A)

(A)

(V)

(A)

(s @ A)

(W)

R

Order

Qty.

Order-

Model

Packaging

Information

Number