データシートサーチシステム |
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TLP554 データシート(PDF) 2 Page - Toshiba Semiconductor |
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TLP554 データシート(HTML) 2 Page - Toshiba Semiconductor |
2 / 8 page TLP554 2007-10-01 2 Recommended Operating Conditions CHARACTERISTIC SYMBOL MIN. TYP. MAX. UNIT Low Level input Voltage VFL -3 0 1.0 V High Level input current IFH 6.3* ⎯ 20 mA Supply Voltage VCC 4.5 5 5.5 V High-Level Enable Voltage VEH 2.0 ⎯ VCC V Low-Level Enable Voltage VEL 0 ⎯ 0.8 V Fan Out(TTL Load) N ⎯ ⎯ 8 ⎯ Operating Temperature Topr 0 ⎯ 70 °C Note: Recommended operating conditions are given as a design guideline to obtain expected performance of the device. Additionally, each item is an independent guideline respectively. In developing designs using this product, please confirm specified characteristics shown in this document. *6.3mA condition permits at least 20% CTR degradation Initial switching threshold is 5.0mA or less. Absolute Maximum Ratings (Ta = 25°C) CHARACTERISTIC SYMBOL RATING UNIT Forward Current IF 20 mA Reverse Voltage VR 5 V Output Current IO 25 mA Output Voltage VO -0.5~7 V Supply Voltage (Note 2) VCC 7 V Enable Voltage (Note 3) VE 5.5 V Output Power Dissipation PO 40 mW Storage Temperature Range Tstg −55~125 °C Operating Temperature Range Topr −40~85 °C Lead Soldering Temperature (10 s) (Note 4) Tsol 260 °C Isolation Voltage (AC, 1 minute, R.H.≤ 60%) (Note 5) BVS 2500 Vrms Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings and the operating ranges. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). (Note 1) The VCC supply voltage to each TLP554 isolator must be bypassed by a 0.1μF capacitor or larger.This can be either a ceramic or solid tantalum capacitor with good high frequency characteristic and should be connected as close as possible to the package VCC and GND pins each device. (Note 2) 1 Minute Maximum. (Note 3) Not to exceed VCC by more than 500mV. (Note 4) 2mm below seating plane. (Note 5) Device considered a two-terminal device :Pins 1,2,3 and 4 shorted together,and Pins 5, 6,7 and 8 shorted together. |
同様の部品番号 - TLP554_07 |
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同様の説明 - TLP554_07 |
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