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FMA3007 データシート(PDF) 7 Page - Filtronic Compound Semiconductors |
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FMA3007 データシート(HTML) 7 Page - Filtronic Compound Semiconductors |
7 / 8 page Specifications subject to change without notice Filtronic Compound Semiconductors Ltd Tel: +44 (0) 1325 301111 Fax: +44 (0) 1325 306177 Email: sales@filcs.com Website: www.filtronic.com 7 Production Datasheet v3.0 FMA3007 BIASING CIRCUIT SCHEMATIC: 100nF 100nF 100pF VG1 100pF RF Output 100pF 100nF VG2 RF Input VDD ASSEMBLY DIAGRAM: It is recommended that the RF connections be made using two bond wires 25µm in diameter and a maximum length of 300µm. Improved input return loss can be achieved, to compensate for bond wire length, with the addition of a microstrip transformer, shown in the diagram below. Substrate: Alumina Thickness: 635µm Transformer Impedance 43 Ω Electrical Length 32º at 10GHz To Evaluation Board via an 0402 Surface Mounted capacitor 100pF Capacitors 100pF Capacitor 0.8mm 0.8mm 0.61mm To Evaluation Board via an 0402 Surface Mounted capacitor 0.61mm 1.0mm 1.0mm BILL OF MATERIALS: COMPONENT All RF tracks should be 50 Ω characteristic material Capacitor, 100pF, chip capacitor Capacitor, 100pF, 0402 |
同様の部品番号 - FMA3007_1 |
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同様の説明 - FMA3007_1 |
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