データシートサーチシステム |
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L6221A データシート(PDF) 11 Page - STMicroelectronics |
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L6221A データシート(HTML) 11 Page - STMicroelectronics |
11 / 15 page Figure 25 : Maximum Dissipable Power and Junc- tion to Ambient Thermal Resistance versus Side ” α” Figure 26 : Maximum Allowable Power Dissipa- tion versus Ambient Temperature Figure 24 : External Heatsink Mounting Example Figure 23 : Example of P.C. Board Copper Area Which is Used as Heatsink MOUNTING INSTRUCTION The Rth j-amb of the L6221A can be reduced by sol- deringthe GND pins to a suitablecopper area of the printed circuit board (Fig. 23) or to an external heatsink (Fig. 24). The diagram of figure 25 shows the maximum dis- sipable power Ptot and the Rth j-amb as a function of the side ” α” of two equal squarecopper areas hav- ing a thickness of 35 µ (1.4 mils). During soldering the pins temperature must not exceed 260 °C and the soldering time must not be longer than 12 sec- onds. The external heatsink or printed circuit copper area must be connected to electrical ground. L6221A - L6221AD - L6221N 11/15 |
同様の部品番号 - L6221A |
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同様の説明 - L6221A |
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