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LMH6626MM データシート(PDF) 5 Page - National Semiconductor (TI) |
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LMH6626MM データシート(HTML) 5 Page - National Semiconductor (TI) |
5 / 19 page ±6V Electrical Characteristics (Continued) Unless otherwise specified, all limits guaranteed at T A = 25˚C, V + = 6V, V− = −6V, V CM = 0V, AV = +20, RF = 500 Ω,R L = 100 Ω. Boldface limits apply at the temperature extremes. See (Note 12). Symbol Parameter Conditions Min (Note 6) Typ (Note 5) Max (Note 6) Units I SC Output Short Circuit Current (LMH6624) Sourcing to Ground ∆V IN = 200mV (Note 3), (Note 11) 100 85 156 mA (LMH6624) Sinking to Ground ∆V IN = −200mV (Note 3), (Note 11) 100 85 156 (LMH6626) Sourcing to Ground ∆V IN = 200mV (Note 3), (Note 11) 65 55 120 (LMH6626) Sinking to Ground ∆V IN = −200mV (Note 3), (Note 11) 65 55 120 I OUT Output Current (LMH6624) Sourcing, V O = +4.3V Sinking, V O = −4.3V 100 mA (LMH6626) Sourcing, V O = +4.3V Sinking, V O = −4.3V 80 Power Supply PSRR Power Supply Rejection Ratio V S = ±5.4V to ±6.6V 82 80 88 dB I S Supply Current (per channel) No Load 12 16 18 mA Note 1: Absolute maximum ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is intended to be functional, but specific performance is not guaranteed. For guaranteed specifications and the test conditions, see the Electrical Characteristics. Note 2: Human body model, 1.5k Ω in series with 100pF. Note 3: Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in exceeding the maximum allowed junction temperature of 150˚C. Note 4: The maximum power dissipation is a function of TJ(MAX), θJA, and TA. The maximum allowable power dissipation at any ambient temperature is PD =(TJ(MAX) -TA)/ θJA . All numbers apply for packages soldered directly onto a PC board. Note 5: Typical Values represent the most likely parametric norm. Note 6: All limits are guaranteed by testing or statistical analysis. Note 7: Average drift is determined by dividing the change in parameter at temperature extremes into the total temperature change. Note 8: Slew rate is the slowest of the rising and falling slew rates. Note 9: Machine Model, 0 Ω in series with 200pF. Note 10: Simulation results. Note 11: Short circuit test is a momentary test. Output short circuit duration is 1.5ms. Note 12: Electrical table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very limited self-heating of the device such that TJ =TA. No guarantee of parametric performance is indicated in the electrical tables under conditions of internal self-heating where TJ > TA. Absolute maximum ratings indicate junction temperature limits beyond which the device may be permanently degraded, either mechanically or electrically. Ordering Information Package Part Number Package Marking Transport Media NSC Drawing SOT23-5 LMH6624MF A94A 1k Units Tape and Reel MF05A LMH6624MFX 3k Units Tape and Reel SOIC-8 LMH6624MA LMH6624MA 95 Units/Rail M08A LMH6624MAX 2.5k Units Tape and Reel SOIC-8 LMH6626MA LMH6626MA 95 Units/Rail M08A LMH6626MAX 2.5k Units Tape and Reel MSOP-8 LMH6626MM A98A 1k Units Tape and Reel MUA08A LMH6626MMX 3.5k Units Tape and Reel www.national.com 5 |
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同様の説明 - LMH6626MM |
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