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TS924AID データシート(PDF) 10 Page - STMicroelectronics |
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TS924AID データシート(HTML) 10 Page - STMicroelectronics |
10 / 14 page Package information TS924 10/14 4 Package information In order to meet environmental requirements, STMicroelectronics offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an STMicroelectronics trademark. ECOPACK specifications are available at: www.st.com. 4.1 DIP14 package information Figure 13. DIP14 package mechanical drawing Table 6. DIP14 package mechanical data Ref. Millimeters Inches Min. Typ. Max. Min. Typ. Max. a1 0.51 0.020 B 1.39 1.65 0.055 0.065 b0.5 0.020 b1 0.25 0.010 D20 0.787 E8.5 0.335 e 2.54 0.100 e3 15.24 0.600 F 7.1 0.280 I 5.1 0.201 L3.3 0.130 Z 1.27 2.54 0.050 0.100 |
同様の部品番号 - TS924AID |
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同様の説明 - TS924AID |
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