© 2006 Fairchild Semiconductor Corporation

www.fairchildsemi.com

FAN5631/FAN5632 Rev. 1.0.2

4

Absolute Maximum Ratings

Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be

operable above the recommended operating conditions and stressing the parts to these levels is not recommended.

In addition, extended exposure to stresses above the recommended operating conditions may affect device

reliability. The absolute maximum ratings are stress ratings only.

Symbol

Parameter

Min.

Max.

Unit

-0.3

6.0

All other pins to GND

-0.3

V

Load Current

0.5

A

Θ

JC

Thermal Resistance Junction-to-Tab

(1)

8

°C/W

Lead Temperature, Soldering 10 Seconds

+260

°C

Junction Temperature

-40

+150

°C

Storage Temperature

-65

+150

°C

Human Body Model, JESD22-A114

2.5

ESD

(2)

Charged Device Model, JESD22-C101

0.2

kV

Notes:

1.

Junction-to-ambient thermal resistance,

θ

number of copper planes, number of via used, diameter of via used, available copper surface, and attached heat

sink characteristics. The estimated value for zero air flow at 0.5W is 60°C/W.

2.

Using Mil Std. 883E, method 3015.7 (Human Body Model) and EIA/JESD22C101-A (Charged Device Model).

Recommended Operating Conditions

The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended

operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not

recommend exceeding them or designing to Absolute Maximum Ratings.

Symbol

Parameter

Min.

Typ.

Max.

Unit

Supply Voltage Range

2.2

5.5

V

250

mA

Operating Ambient Temperature Range

-40

+25

+85

°C