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MCZ33790EG データシート(PDF) 4 Page - Freescale Semiconductor, Inc |
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MCZ33790EG データシート(HTML) 4 Page - Freescale Semiconductor, Inc |
4 / 12 page Analog Integrated Circuit Device Data 4 Freescale Semiconductor 33790 ELECTRICAL CHARACTERISTICS MAXIMUM RATINGS ELECTRICAL CHARACTERISTICS MAXIMUM RATINGS Table 2. Maximum Ratings All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent damage to the device. Ratings Symbol Value Unit ELECTRICAL RATINGS Supply Voltage Continuous Load Dump - t < 300 ms VSUP VSUP(t) -0.5 to 25 40 V Maximum Voltage on Input/Output Pins VDD DSIxS, DSIxF (1) DSIxO (1) -0.3 to 5.5 -0.3 to VDD+0.3 -0.3 to VSUP+0.3 V Storage Temperature TSTG -55 to 150 °C Operating Ambient Temperature TA -40 to 85 °C Operating Junction Temperature TJ -40 to 150 °C Peak Package Reflow Temperature During Reflow (2), (3) TPPRT Note 3 °C Continuous Current per Pin VDD DSIxR VSUP 0 to 10 -2.5 to 5.0 500 mA Thermal Resistance Junction to Ambient RθJA 45 °C/W Thermal Shutdown TSD 155 to 190 °C ESD Voltage (All Pins) (4) Human Body Model Machine Model VESD1 VESD2 ±2000 ±200 V Notes 1. R = 0 Ω. 2. Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may cause malfunction or permanent damage to the device. 3. Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow Temperature and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes and enter the core ID to view all orderable parts. (i.e. MC33xxxD enter 33xxx), and review parametrics. 4. ESD1 performed in accordance with the Human Body Model (CZAP=100pF, RZAP=1500 Ω), ESD2 performed in accordance with the Machine Model (CZAP=200 pF, RZAP=0 Ω). |
同様の部品番号 - MCZ33790EG |
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同様の説明 - MCZ33790EG |
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