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CS206 データシート(PDF) 2 Page - Vishay Siliconix

部品番号 CS206
部品情報  Resistor/Capacitor Networks ECL Terminators and Line Terminator, Conformal Coated, SIP
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メーカー  VISHAY [Vishay Siliconix]
ホームページ  http://www.vishay.com
Logo VISHAY - Vishay Siliconix

CS206 データシート(HTML) 2 Page - Vishay Siliconix

  CS206_08 Datasheet HTML 1Page - Vishay Siliconix CS206_08 Datasheet HTML 2Page - Vishay Siliconix CS206_08 Datasheet HTML 3Page - Vishay Siliconix  
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Document Number: 31519
For technical questions, contact: ff2aresistors@vishay.com
www.vishay.com
Revision: 07-Aug-08
2
CS206
Resistor/Capacitor Networks
ECL Terminators and Line Terminator, Conformal Coated, SIP
Vishay Dale
DIMENSIONS in inches [millimeters]
Pin #1 is extreme left-hand terminal on side with marking.
NUMBER
OF PINS
L
MAXIMUM
NUMBER
OF PINS
L
MAXIMUM
NUMBER
OF PINS
L
MAXIMUM
NUMBER
OF PINS
L
MAXIMUM
NUMBER
OF PINS
L
MAXIMUM
4 pin
0.400 [10.16]
7 pin
0.700 [17.78]
10 pin
1.000 [25.40]
13 pin
1.300 [33.02]
16 pin
1.600 [40.64]
5 pin
0.500 [12.70]
8 pin
0.800 [20.32]
11 pin
1.100 [27.94]
14 pin
1.400 [35.56]
17 pin
1.700 [43.18]
6 pin
0.600 [15.24]
9 pin
0.900 [22.86]
12 pin
1.200 [30.48]
15 pin
1.500 [38.10]
18 pin
1.800 [45.72]
0.135 [3.43] Max.
0
. 007 [0.178]
Ref.
Seating Plane
for 0.040 [1.016] Ø Hole
0.085 [2.160] Typ.
0.050 [1.27] Typ.
0.135 + 0.015 - 0.010
[3.43 + 0.381 - 0.254]
0.010
[0.254]
H (Height) Maximum:
B = 0.250" [6.35] (Circuit E and M)
C = 0.350" [8.89] (Circuit T)
E = 0.325" [8.26] (Circuit A)
C
L
0.100 ± 0.005 [2.54 ± 0.127]
Non-Cumulative
at Point of Egress
H
Max.
L
Max.
0.020
[0.508]
0.050 [1.27]
Derating
150
100
50
0
25
50
75
100
125
150
Ambient Temperature °C
70
0
TECHNICAL SPECIFICATIONS
Flammability:
UL 94V-0
Lead Material:
Phosphorus-bronze, solder plated
Body Material:
Epoxy coated
Solderability:
Per MIL-STD-202, Method 208E
Part Marking:
Pin #1 identification, part number
(abbreviated as space allows),
DALE® or D, date code
Moisture
Resistance:
Meets requirements of MIL-STD-202,
Method 106
PERFORMANCE
TEST
CONDITION
MAX.
ΔR
(Typical Test Lots)
Thermal Shock
Subject to 5 cycles from - 65 °C to + 125 °C
± 0.5 %
ΔR
Short Time Overload
2.5 x rated working voltage for 5 s at + 25 °C
± 0.25 %
ΔR
Moisture Resistance
Cycle from + 25 °C to + 65 °C to + 25 °C over 8 h at 90 - 98 % relative humidity,
with 10 % of rated power applied, for 20 cycles. Stop cycling after an even number
of cycles and stabilize networks at high humidity for 1 to 4 h. Condition networks at
- 10 °C for 3 h, then return to temperature cycling. On completion of cycling
condition networks at + 25 °C at 50 % r.h. for 22 to 24 h
± 0.5 %
ΔR
Resistance to Soldering Heat
Immerse pins in melted solder to the lead standoffs at + 350 °C for 3 s max.
± 0.25 %
ΔR
Mechanical Shock
18 shocks of 100 G and 6 ms
± 0.25 %
ΔR
Vibration
12 cycles varied logarithmically from 10 Hz to 2000 Hz to 10 Hz over 20 min
± 0.25 %
ΔR
Load Life
1000 h at + 70 °C, rated power applied 1.5 h “ON”, 0.5 h “OFF”
± 1.0 %
ΔR
Resistance to Solvents
Immerse and scrub samples with isopropyl alcohol, trichlorethylene and Freon
TMC
Marking remains legible
Solderability
Immerse leads in 60/40 tin-lead solder using R flux at + 245 °C for 5 s maximum
Minimum 95 % solder
coverage
Terminal Strength
Withstand 2.2 kg pull 1 min
± 0.25 %
ΔR
Case Insulation Resistance
100 V applied between case and terminals tied together
IR = 10 000 M
Ω
minimum


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