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ADV7181CBCPZ-REEL データシート(PDF) 8 Page - Analog Devices

部品番号 ADV7181CBCPZ-REEL
部品情報  10-Bit, Integrated, Multiformat SDTV Video Decoder and RGB Graphics Digitizer
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メーカー  AD [Analog Devices]
ホームページ  http://www.analog.com
Logo AD - Analog Devices

ADV7181CBCPZ-REEL データシート(HTML) 8 Page - Analog Devices

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ADV7181C
Rev. 0 | Page 8 of 20
ABSOLUTE MAXIMUM RATINGS
Table 5.
Parameter
Rating
AVDD to AGND
4 V
DVDD to DGND
2.2 V
PVDD to AGND
2.2 V
DVDDIO to DGND
4 V
DVDDIO to AVDD
−0.3 V to +0.3 V
PVDD to DVDD
−0.3 V to +0.3 V
DVDDIO to PVDD
−0.3 V to +2 V
DVDDIO to DVDD
−0.3 V to +2 V
AVDD to PVDD
−0.3 V to +2 V
AVDD to DVDD
−0.3 V to +2 V
Digital Inputs Voltage to DGND
DGND − 0.3 V to
DVDDIO + 0.3 V
Digital Outputs Voltage to DGND
DGND − 0.3 V to
DVDDIO + 0.3 V
Analog Inputs to AGND
AGND − 0.3 V to
AVDD + 0.3 V
Operating Temperature
−40°C to +85°C
Maximum Junction Temperature (TJ MAX)
125°C
Storage Temperature Range
−65°C to +150°C
Infrared Reflow Soldering (20 sec)
260°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
PACKAGE THERMAL PERFORMANCE
To reduce power consumption when using the part the user is
advised to turn off any unused ADCs.
It is imperative that the recommended scripts be used for the
following high current modes: SCART, 720p, 1080i, and all
RGB graphic standards. Using the recommended scripts ensures
correct thermal performance. These scripts are available from
a local FAE.
The junction temperature must always stay below the
maximum junction temperature (TJ MAX) of 125°C. Using
the following equation, calculate the junction temperature:
TJ = TA MAX + (θJA × WMAX)
where:
TA MAX = 85°C.
θJA = 45.5°C/W.
WMAX = ((AVDD × IAVDD) + (DVDD × IDVDD) + (DVDDIO ×
IDVDDIO) + (PVDD × IPVDD)).
THERMAL SPECIFICATIONS
Table 6.
Package Type
θJA1
θJC2
Unit
64-Lead LQFP
45.5
9.2
°C/W
64-Lead LFCSP_VQ
20.3
1.2
°C/W
1 4-layer PCB with solid ground plane (still air).
2 4-layer PCB with solid ground plane.
ESD CAUTION


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