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BCP69-25 データシート(PDF) 4 Page - NXP Semiconductors |
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BCP69-25 データシート(HTML) 4 Page - NXP Semiconductors |
4 / 13 page BCP69_6 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 06 — 2 December 2008 4 of 13 NXP Semiconductors BCP69 20 V, 1 A PNP medium power transistor 6. Thermal characteristics [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1 cm2. [3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 6 cm2. (1) FR4 PCB, mounting pad for collector 6 cm2 (2) FR4 PCB, mounting pad for collector 1 cm2 (3) FR4 PCB, standard footprint Fig 1. Power derating curves −65 −5 Tamb (°C) Ptot (W) 55 175 1.6 1.2 0.4 0 0.8 115 mle311 (1) (2) (3) Table 7. Thermal characteristics Symbol Parameter Conditions Min Typ Max Unit Rth(j-a) thermal resistance from junction to ambient in free air [1] - - 200 K/W [2] - - 125 K/W [3] --89 K/W Rth(j-sp) thermal resistance from junction to solder point --15 K/W |
同様の部品番号 - BCP69-25 |
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同様の説明 - BCP69-25 |
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