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TC1014-3.0VCT データシート(PDF) 9 Page - TelCom Semiconductor, Inc |
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TC1014-3.0VCT データシート(HTML) 9 Page - TelCom Semiconductor, Inc |
9 / 10 page TC1015 4 100mA CMOS LDO WITH SHUTDOWN AND REFERENCE BYPASS PRELIMINARY INFORMATION TC1015-01-6/5/97 PD ≈ (VINMAX – VOUTMIN)ILOADMAX Where: PD = Worst case actual power dissipation VIN MAX = Maximum voltage on VIN VOUT MIN = Minimum regulator output voltage ILOAD MAX = Maximum output (load) current Equation 1. The maximum allowable power dissipation (Equation 2) is a function of the maximum ambient temperature (TAMAX), the maximum allowable die temperature (125 °C) and the thermal resistance from junction-to-air ( θJA). The SOT-23A-5 package has a θJA of approximately 220°C/Watt when mounted on a single layer FR4 dielectric copper clad PC board. PD MAX = (TJMAX – TJMAX) θJA Where all terms are previously defined. Equation 2. Equation 1 can be used in conjunction with Equation 2 to ensure regulator thermal operation is within limits. For example: Given: VIN MAX = 3.0V ±10% VOUT MIN = 2.7V ±0.5V ILOAD = 98mA TAMAX = 55°C Find: 1. Actual power dissipation 2. Maximum allowable dissipation Actual power dissipation: PD ≈ (VINMAX – VOUTMIN)ILOADMAX = [(3.0 x 1.1) – (2.7 x .995)]98 x 10–3 = 60mW Maximum allowable power dissipation: PD MAX = (TJMAX – TAMAX) θJA = (125 – 55) 220 = 318mW In this example, the TC1015 dissipates a maximum of only 60mW; far below the allowable limit of 318mW. In a similar manner, Equation 1 and Equation 2 can be used to calculate maximum current and/or input voltage limits. For example, the maximum allowable VIN is found by sustituting the maximum allowable power dissipation of 318mW into Equation 1, from which VINMAX = 5.9V. Layout Considerations The primary path of heat conduction out of the package is via the package leads. Therefore, layouts having a ground plane, wide traces at the pads, and wide power supply bus lines combine to lower θJA and, therefore, increase the maximum allowable power dissipation limit. |
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