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NBXDBA009 データシート(PDF) 5 Page - ON Semiconductor |
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NBXDBA009 データシート(HTML) 5 Page - ON Semiconductor |
5 / 6 page NBXDBA009 http://onsemi.com 5 Table 8. RELIABILITY COMPLIANCE Parameter Standard Method Shock Mechanical MIL−STD−833, Method 2002, Condition B Solderability Mechanical MIL−STD−833, Method 2003 Vibration Mechanical MIL−STD−833, Method 2007, Condition A Solvent Resistance Mechanical MIL−STD−202, Method 215 Thermal Shock Environment MIL−STD−833, Method 1011, Condition A Moisture Level Sensitivity Environment MSL1 260°C per IPC/JEDEC J−STD−020D Figure 5. Typical Termination for Output Driver and Device Evaluation (See Application Note AND8020/D − Termination of ECL Logic Devices.) Driver Device Receiver Device CLK D CLK D Zo = 50 W Zo = 50 W 50 W 50 W VTT VTT = VDD − 2.0 V NBXDBA009 260 217 175 150 Temperature (°C) temp. 260°C 20 − 40 sec. max. Time 60180 sec. 3°C/sec. max. cooling 6°C/sec. max. 60150 sec. reflow peak pre−heat ramp−up Figure 6. Recommended Reflow Soldering Profile |
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同様の説明 - NBXDBA009 |
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