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74526-1001 データシート(PDF) 1 Page - Molex Electronics Ltd.

部品番号 74526-1001
部品情報  LaneLink??10GBASE-CX4 Cable Assemblies
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メーカー  MOLEX [Molex Electronics Ltd.]
ホームページ  http://www.molex.com
Logo MOLEX - Molex Electronics Ltd.

74526-1001 データシート(HTML) 1 Page - Molex Electronics Ltd.

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FEATURES AND SPECIFICATIONS
SPECIFICATIONS
0.50mm (.020") Pitch
LaneLink™ 10GBASE-CX4
Cable Assemblies
74526
Molex’s superior design and engineering, along with
state-of-the-art manufacturing, combine to provide a
solution for all 10GBASE-CX4 applications. The 10
Gigabit Ethernet (10 GbE) Alliance was organized to
facilitate and accelerate the introduction of 10GbE into
the networking market. The main factor driving
10GbE is the increase in internet and intranet traffic.
Factors contributing to this growth include increases in
the number of network connections, increases in the
connection speed of each end-station, and an increase
in web- hosting and application-hosting traffic.
LaneLink CX4 cable assemblies are designed and
engineered to meet the architecture set forth by IEEE
802.3. The 802.3ak design uses four transmitters and
four receivers operating differentially over a bundle of
thin twin-axial cables to transmit 2.5 Gbps each, as
opposed to transmitting 10 Gbps over a single copper
link. This requires four differential pairs in each
direction, totaling eight twin-axial channels per
assembly.
This I/O system has been adapted by several other
standards or MSA groups in addition to CX4, noted
below in the ‘Regional Markets, Applications and
Typical Customers’ section.
For more information on CX4, visit the website at:
www.ieee802.org/3/10GBCX4/.
Reference Information
Mates With: 91525-XXXX (latch)
Designed In: Millimeters
Electrical
Voltage: 30V AC per contact
Current: 0.5A per contact
Contact Resistance: 80
Dielectric Withstanding Voltage: 300V/minimum DC
Insulation Resistance: 10,000M
Ω minimum between
adjacent contacts
Mechanical
Mating Force: 55.5N
Unmating Force: 49.0N
Durability: 250 cycles
Physical
Housing: Zinc die cast
Contact: Gold flash over Nickel plating
Plating: Contact Area – Nickel
Solder Tail Area – Nickel allover
Underplating – Gold flash over Paladium
Nickel
Operating Temperature: -20 to + 85°C
Features and Benefits
I Squeeze-to-release latch provides user with easy-to-
use positive latch and unlatch system from the PCB
connector
I Molex offers a total 4X system solution providing
industry standard interfaces with LaneLink 4X
connectors (91525 Series), XENPAK modules
(74734 Series), XPAK modules (74732 Series) and
X2 copper transceivers (74735 Series)
I Designed to allow customers to use pre-emphasis on
the board level silicon (customer needs to modify
their board for the signal to achieve optimum length)
to provide cable length in excess of 15 meters
I High performance production test rack provides
100% eye-pattern testing
10GBASE-CX4 LaneLink Cable Assemblies
Connect Servers or Switches Over Short
Distances


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