データシートサーチシステム |
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TL064CD データシート(PDF) 5 Page - Texas Instruments |
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TL064CD データシート(HTML) 5 Page - Texas Instruments |
5 / 23 page TL061, TL061A, TL061B, TL061Y, TL062, TL062A TL062B, TL062Y, TL064, TL064A, TL064B, TL064Y LOW-POWER JFET-INPUT OPERATIONAL AMPLIFIERS SLOS078F – NOVEMBER 1978 – REVISED JANUARY 1999 5 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 TL062Y chip information This chip, when properly assembled, has characteristics similar to the TL062. Thermal compression or ultrasonic bonding can be used on the doped-aluminum bonding pads. The chips can be mounted with conductive epoxy or a gold-silicon preform. Bonding-Pad Assignments Chip Thickness: 15 Mils Typical Bonding Pads: 4 × 4 Mils Minimum TJ(max) = 150°C Tolerances Are ±10%. All Dimensions Are in Mils. Pin (4) is Internally Connected to Backside of Chip. + – 1OUT 1IN+ 1IN– VCC+ (8) (6) (3) (2) (5) (1) – + (7) 2IN+ 2IN– 2OUT (4) VCC– 66 49 (6) (5) (4) (3) (2) (1) (8) (7) |
同様の部品番号 - TL064CD |
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同様の説明 - TL064CD |
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