データシートサーチシステム |
|
TL051AMP データシート(PDF) 5 Page - Texas Instruments |
|
TL051AMP データシート(HTML) 5 Page - Texas Instruments |
5 / 65 page TL05x, TL05xA, TL05xY ENHANCED-JFET LOW-OFFSET OPERATIONAL AMPLIFIERS SLOS178 – FEBRUARY 1997 5 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 TL052Y chip information This chip, when properly assembled, displays characteristics similar to the TL052. Thermal compression or ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with conductive epoxy or a gold-silicon preform. BONDING PAD ASSIGNMENTS CHIP THICKNESS: 15 MILS TYPICAL BONDING PADS: 4 × 4 MILS MINIMUM TJmax = 150°C TOLERANCES ARE ±10%. ALL DIMENSIONS ARE IN MILS. PIN (4) IS INTERNALLY CONNECTED TO BACKSIDE OF CHIP. + – 1OUT 1IN + 1IN – VCC+ (8) (6) (3) (2) (5) (1) – + (7) 2IN + 2IN – 2OUT (4) VCC – (1) (2) (3) (4) (5) (6) (7) (8) 66 72 |
同様の部品番号 - TL051AMP |
|
同様の説明 - TL051AMP |
|
|
リンク URL |
プライバシーポリシー |
ALLDATASHEET.JP |
ALLDATASHEETはお客様のビジネスに役立ちますか? [ DONATE ] |
Alldatasheetは | 広告 | お問い合わせ | プライバシーポリシー | リンク交換 | メーカーリスト All Rights Reserved©Alldatasheet.com |
Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
Family Site : ic2ic.com |
icmetro.com |