CONNECTION DIAGRAMS

Output Current (Each Output, Source or Sink)

Steady-State . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.5A

Peak Transient . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3A

Ouput Voltage . . . . . . . . . . . . . . . . . . . . . . .

Enable and Shutdown Inputs . . . . . . . . . . . . . . . . .

A and B Inputs . . . . . . . . . . . . . . . . . . . . . . .

Operating Junction Temperature (Note 2) . . . . . . . . . . . . 150

°C

Storage Temperature Range . . . . . . . . . . . . . . . . -65

° to 150°C

Lead Temperature (Soldering, 10 Seconds) . . . . . . . . . . 300

°C

ABSOLUTE MAXIMUM RATINGS (Note 1)

UC1708

UC2708

UC3708

NOTE 1: All voltages are with respect to Logic Gnd pin. All cur-

rents are positive into, negative out of, device terminals.

NOTE 2: Consult Unitrode Integrated Circuits databook for

information regarding thermal specifications and limitations of

packages.

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNITS

OutputsLow

18

26

mA

Outputs High

14

18

mA

Enable = 0V

1

4

mA

A, B and Shutdown Inputs Low

Level

0.8

V

A, B and Shutdown Inputs High

Level

2.0

V

A, B Input Current Low

-1

-0.6

mA

A, B Input Current High

-200

50

µA

A, B Input Leakage Current High

200

µA

Shutdown Input Current Low

20

100

µA

Shutdown Input Current High

170

500

µA

0.6

1.5

mA

–55

DIL-8 (Top View)

J Or N Package

Note: In JE package Pin 4 is logic ground. Pins 5, 12,

and 13 are N/C.

DIL-16 (Top View)

JE or NE Package

SOIC-16 (Top View)

DW Package

2