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STK14C88-3WF35 データシート(PDF) 6 Page - Cypress Semiconductor

部品番号 STK14C88-3WF35
部品情報  256 Kbit (32K x 8) AutoStore nvSRAM
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メーカー  CYPRESS [Cypress Semiconductor]
ホームページ  http://www.cypress.com
Logo CYPRESS - Cypress Semiconductor

STK14C88-3WF35 データシート(HTML) 6 Page - Cypress Semiconductor

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STK14C88-3
Document Number: 001-50592 Rev. **
Page 6 of 17
Best Practices
nvSRAM products have been used effectively for over 15
years. While ease-of-use is one of the product’s main system
values, experience gained working with hundreds of applica-
tions has resulted in the following suggestions as best
practices:
The nonvolatile cells in an nvSRAM are programmed on the
test floor during final test and quality assurance. Incoming
inspection routines at customer or contract manufacturer’s
sites, sometimes, reprogram these values. Final NV patterns
are typically repeating patterns of AA, 55, 00, FF, A5, or 5A.
End product’s firmware should not assume an NV array is in
a set programmed state. Routines that check memory
content values to determine first time system configuration
and cold or warm boot status, should always program a
unique NV pattern (for example, a complex 4-byte pattern of
46 E6 49 53 hex or more random bytes) as part of the final
system manufacturing test to ensure these system routines
work consistently. Power up boot firmware routines should
rewrite the nvSRAM into the desired state. While the
nvSRAM is shipped in a preset state, best practice is to again
rewrite the nvSRAM into the desired state as a safeguard
against events that might flip the bit inadvertently (program
bugs or incoming inspection routines).
The VCAP value specified in this data sheet includes a
minimum and a maximum value size. Best practice is to meet
this requirement and not exceed the max VCAP value
because the higher inrush currents may reduce the reliability
of the internal pass transistor. Customers who want to use a
larger VCAP value to ensure there is extra store charge
should discuss their VCAP size selection with Cypress to
understand any impact on the VCAP voltage level at the end
of a tRECALL period.
Table 2. Hardware Mode Selection
CE
WE
HSB
A13 – A0
Mode
IO
Power
H
X
H
X
Not Selected
Output High Z
Standby
L
H
H
X
Read SRAM
Output Data
Active[1]
L
L
H
X
Write SRAM
Input Data
Active
X
X
L
X
Nonvolatile Store
Output High Z
ICC2
[2]
LH
H
0x0E38
0x31C7
0x03E0
0x3C1F
0x303F
0x0FC0
Read SRAM
Read SRAM
Read SRAM
Read SRAM
Read SRAM
Nonvolatile STORE
Output Data
Output Data
Output Data
Output Data
Output Data
Output Data
Active[1, 3, 4, 5]
LH
H
0x0E38
0x31C7
0x03E0
0x3C1F
0x303F
0x0C63
Read SRAM
Read SRAM
Read SRAM
Read SRAM
Read SRAM
Nonvolatile RECALL
Output Data
Output Data
Output Data
Output Data
Output Data
Output Data
Active[1, 3, 4, 5]
Notes
1. I/O state assumes OE < VIL. Activation of nonvolatile cycles does not depend on state of OE.
2. HSB STORE operation occurs only if an SRAM WRITE has been done since the last nonvolatile cycle. After the STORE (if any) completes, the part will go
into standby mode, inhibiting all operations until HSB rises.
3. CE and OE LOW and WE HIGH for output behavior.
4. The six consecutive addresses must be in the order listed. WE must be high during all six consecutive CE controlled cycles to enable a nonvolatile cycle.
5. While there are 15 addresses on the STK14C88-3, only the lower 14 are used to control software modes.
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