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CS48DV2B データシート(PDF) 11 Page - Cirrus Logic

部品番号 CS48DV2B
部品情報  32-bit Audio DSP for Dedicated Dolby Volume and Audistry by Dolby
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メーカー  CIRRUS [Cirrus Logic]
ホームページ  http://www.cirrus.com
Logo CIRRUS - Cirrus Logic

CS48DV2B データシート(HTML) 11 Page - Cirrus Logic

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CS48DV2B Data Sheet
32-bit Audio DSP for Dedicated Dolby Volume and Audistry by Dolby
DS875F2
Copyright 2009 Cirrus Logic
11
CONFIDENTIAL
5.4 Power Supply Characteristics
(Measurements performed under operating conditions)
5.5 Thermal Data (48-Pin LQFP)
1. Two-layer board is specified as a 76 mm X 114 mm, 1.6 mm thick FR-4 material with 1-oz. copper covering 20 % of the top &
bottom layers.
2. Four-layer board is specified as a 76 mm X 114 mm, 1.6 mm thick FR-4 material with 1-oz. copper covering 20 % of the top &
bottom layers and 0.5-oz. copper covering 90 % of the internal power plane & ground plane layers.
3. To calculate the die temperature for a given power dissipation
T
j = Ambient Temperature + [ (Power Dissipation in Watts) *
θ
ja ]
4. To calculate the case temperature for a given power dissipation
T
c = Tj - [ (Power Dissipation in Watts) *
ψ
jt ]
Parameter
Min
Typ
Max
Unit
Operational Power Supply Current:
VDD: Core and I/O operating1
VDDA: PLL operating
VDDIO: With most ports operating
Total Operational Power Dissipation:
Standby Power Supply Current:
VDD: Core and I/O not clocked
VDDA: PLL halted
VDDIO: All connected I/O pins 3-stated by other ICs in system
Total Standby Power Dissipation:
1. Dependent on application firmware and DSP clock speed.
-
-
-
-
-
-
-
203
8
27
480
100
1
50
348
-
-
-
-
-
-
-
mA
mA
mA
mW
μA
μA
μA
μW
Parameter
Symbol
Min
Typ
Max
Unit
Junction Temperature
Tj
-
-
125
°C
Thermal Resistance (Junction to Ambient)
Two-layer Board1
Four-layer Board2
θ
ja
-
-
63.5
54
-
-
°C / Watt
Thermal Resistance (Junction to Top of Package)
Two-layer Board3
Four-layer Board4
ψ
jt
-
-
0.70
0.64
-
-
°C / Watt


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