データシートサーチシステム |
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LA38B-81-VG-PF データシート(PDF) 6 Page - LIGITEK electronics co., ltd. |
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LA38B-81-VG-PF データシート(HTML) 6 Page - LIGITEK electronics co., ltd. |
6 / 6 page Page 5/5 Reference Standard MIL-STD-883:1008 JIS C 7021: B-10 JIS C 7021: B-12 MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 Description Test Item Test Condition Reliability Test: 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) Low Temperature Storage Test High Temperature Storage Test Operating Life Test 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only MIL-STD-202:103B JIS C 7021: B-11 MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 1.Ta=65 ℃±5℃ 2.RH=90 %~95% 3.t=240hrs ±2hrs 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. 1.Ta=105 ℃±5℃&-40℃±5℃ (10min) (10min) 2.total 10 cycles Solder Resistance Test High Temperature High Humidity Test Thermal Shock Test 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec Solderability Test This test intended to see soldering well performed or not. The purpose of this test is the resistance of the device under tropical for hours. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. PART NO. LA38B-81/VG-PF |
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同様の説明 - LA38B-81-VG-PF |
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