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CSD17310Q5A データシート(PDF) 2 Page - Texas Instruments

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部品番号 CSD17310Q5A
部品情報  30V, N-Channel NexFET??Power MOSFETs
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メーカー  TI [Texas Instruments]
ホームページ  http://www.ti.com
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CSD17310Q5A データシート(HTML) 2 Page - Texas Instruments

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CSD17310Q5A
SLPS255 – FEBRUARY 2010
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ELECTRICAL CHARACTERISTICS
(TA = 25°C unless otherwise stated)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
Static Characteristics
BVDSS
Drain to Source Voltage
VGS = 0V, ID = 250mA
30
V
IDSS
Drain to Source Leakage Current
VGS = 0V, VDS = 24V
1
mA
IGSS
Gate to Source Leakage Current
VDS = 0V, VGS = +10/-8V
100
nA
VGS(th)
Gate to Source Threshold Voltage
VDS = VGS, ID = 250mA
0.9
1.3
1.8
V
VGS = 3V, ID = 20A
5.7
7.8
m
RDS(on)
Drain to Source On Resistance
VGS = 4.5V, ID = 20A
4.5
5.9
m
VGS = 8V, ID = 20A
3.9
5.1
m
gfs
Transconductance
VDS = 15V, ID = 20A
85
S
Dynamic Characteristics
Ciss
Input Capacitance
1200
1560
pF
Coss
Output Capacitance
VGS = 0V, VDS = 15V, f = 1MHz
630
820
pF
Crss
Reverse Transfer Capacitance
59
77
pF
RG
Series Gate Resistance
0.9
1.8
Qg
Gate Charge Total (4.5V)
8.9
11.6
nC
Qgd
Gate Charge Gate to Drain
2.1
nC
VDS = 15V, IDS = 20A
Qgs
Gate Charge Gate to Source
2.7
nC
Qg(th)
Gate Charge at Vth
1.4
nC
Qoss
Output Charge
VDS = 12.8V, VGS = 0V
15.9
nC
td(on)
Turn On Delay Time
6.5
ns
tr
Rise Time
11.6
ns
VDS = 15V, VGS = 4.5V, IDS = 20A,
RG = 2Ω
td(off)
Turn Off Delay Time
15
ns
tf
Fall Time
5
ns
Diode Characteristics
VSD
Diode Forward Voltage
ISD = 20A, VGS = 0V
0.85
1
V
Qrr
Reverse Recovery Charge
21
nC
VDD= 12.8V, IF = 20A, di/dt = 300A/ms
trr
Reverse Recovery Time
22
ns
THERMAL CHARACTERISTICS
(TA = 25°C unless otherwise stated)
PARAMETER
MIN
TYP
MAX
UNIT
RqJC
Thermal Resistance Junction to Case(1)
1.9
°C/W
RqJA
Thermal Resistance Junction to Ambient(1)(2)
51
°C/W
(1)
RqJC is determined with the device mounted on a 1-inch
2 (6.45-cm2), 2-oz. (0.071-mm thick) Cu pad on a 1.5-inch × 1.5-inch (3.81-cm ×
3.81-cm), 0.06-inch (1.52-mm) thick FR4 PCB. RqJC is specified by design, whereas RqJA is determined by the user’s board design.
(2)
Device mounted on FR4 material with 1-inch2 (6.45-cm2), 2-oz. (0.071-mm thick) Cu.
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