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CSD17310Q5A データシート(PDF) 2 Page - Texas Instruments |
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CSD17310Q5A データシート(HTML) 2 Page - Texas Instruments |
2 / 10 page CSD17310Q5A SLPS255 – FEBRUARY 2010 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise stated) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Static Characteristics BVDSS Drain to Source Voltage VGS = 0V, ID = 250mA 30 V IDSS Drain to Source Leakage Current VGS = 0V, VDS = 24V 1 mA IGSS Gate to Source Leakage Current VDS = 0V, VGS = +10/-8V 100 nA VGS(th) Gate to Source Threshold Voltage VDS = VGS, ID = 250mA 0.9 1.3 1.8 V VGS = 3V, ID = 20A 5.7 7.8 m Ω RDS(on) Drain to Source On Resistance VGS = 4.5V, ID = 20A 4.5 5.9 m Ω VGS = 8V, ID = 20A 3.9 5.1 m Ω gfs Transconductance VDS = 15V, ID = 20A 85 S Dynamic Characteristics Ciss Input Capacitance 1200 1560 pF Coss Output Capacitance VGS = 0V, VDS = 15V, f = 1MHz 630 820 pF Crss Reverse Transfer Capacitance 59 77 pF RG Series Gate Resistance 0.9 1.8 Ω Qg Gate Charge Total (4.5V) 8.9 11.6 nC Qgd Gate Charge Gate to Drain 2.1 nC VDS = 15V, IDS = 20A Qgs Gate Charge Gate to Source 2.7 nC Qg(th) Gate Charge at Vth 1.4 nC Qoss Output Charge VDS = 12.8V, VGS = 0V 15.9 nC td(on) Turn On Delay Time 6.5 ns tr Rise Time 11.6 ns VDS = 15V, VGS = 4.5V, IDS = 20A, RG = 2Ω td(off) Turn Off Delay Time 15 ns tf Fall Time 5 ns Diode Characteristics VSD Diode Forward Voltage ISD = 20A, VGS = 0V 0.85 1 V Qrr Reverse Recovery Charge 21 nC VDD= 12.8V, IF = 20A, di/dt = 300A/ms trr Reverse Recovery Time 22 ns THERMAL CHARACTERISTICS (TA = 25°C unless otherwise stated) PARAMETER MIN TYP MAX UNIT RqJC Thermal Resistance Junction to Case(1) 1.9 °C/W RqJA Thermal Resistance Junction to Ambient(1)(2) 51 °C/W (1) RqJC is determined with the device mounted on a 1-inch 2 (6.45-cm2), 2-oz. (0.071-mm thick) Cu pad on a 1.5-inch × 1.5-inch (3.81-cm × 3.81-cm), 0.06-inch (1.52-mm) thick FR4 PCB. RqJC is specified by design, whereas RqJA is determined by the user’s board design. (2) Device mounted on FR4 material with 1-inch2 (6.45-cm2), 2-oz. (0.071-mm thick) Cu. Text and br Added for Spacing Text and br Added for Spacing Text and br Added for Spacing Text and br Added for Spacing 2 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): CSD17310Q5A |
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同様の説明 - CSD17310Q5A |
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