1

2

7

5

3

6

1A

1Y

2A

2Y

1OE

2OE

SN74AUP2G240

SCES760B – DECEMBER 2009 – REVISED MARCH 2010

www.ti.com

The SN74AUP2G240 is designed specifically to improve the performance and density of 3-state memory address

drivers, clock drivers, and bus-oriented receivers and transmitters.

NanoStar™ package technology is a major breakthrough in IC packaging concepts, using the die as the

package.

preventing damaging current backflow through the device when it is powered down.

ORDERABLE PART NUMBER

NanoStar™ – WCSP (DSBGA)

Reel of 3000

SN74AUP2G240YFPR

_ _ _ H K _

0.23-mm Large Bump – YFP (Pb-free)

uQFN – DQE

Reel of 5000

SN74AUP2G240DQER

PY

–40°C to 85°C

QFN – RSE

Reel of 5000

SN74AUP2G240RSER

PY

SSOP – DCU

Reel of 3000

SN74AUP2G240DCUR

H40_

(1)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

web site at www.ti.com.

(2)

Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.

(3)

DCU: The actual top-side marking has one additional character that designates the wafer fab/assembly site.

YFP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following

character to designate the wafer fab/assembly site. Pin 1 identifier indicates solder-bump composition (1 = SnPb,

● = Pb-free).

FUNCTION TABLE

(EACH BUFFER)

INPUTS

OUTPUT

Y

OE

A

L

H

L

L

L

H

H

X

Z

LOGIC DIAGRAM (POSITIVE LOGIC)

Pin numbers shown are for the DCU and DQE packages.

2

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Product Folder Link(s): SN74AUP2G240