© 2009 Fairchild Semiconductor Corporation

www.fairchildsemi.com

FAN5341 • Rev. 1.0.0

10

Physical Dimensions

SIDE VIEW

NOTES:

BOTTOM VIEW

TOP VIEW

RECOMMENDED LAND PATTERN

2.40

1.40

0.85

1

3

64

13

6

4

0.30

0.65

0.50

B

A

2X

2X

0.05

0.00

0.55 MAX

0.10 C

0.08 C

(0.15)

C

SEATING

PLANE

2.0

2.0

0.65

1.30

0.70

0.80

1.35

1.45

0.35

0.25

0.35

0.25

PIN1

IDENT

0.10 C A B

0.05 C

6x

6x

1.50

1.60

PIN1

IDENT

0.10 C

0.10 C

0.27

Figure 15. 6-Lead Molded Leadless Package (UMLP)

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