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EZANPE101M データシート(PDF) 4 Page - Panasonic Semiconductor

部品番号 EZANPE101M
部品情報  Chip Capacitor Networks
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メーカー  PANASONIC [Panasonic Semiconductor]
ホームページ  http://www.panasonic.com/industrial/
Logo PANASONIC - Panasonic Semiconductor

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Chip Capacitor Networks
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Preheating
Peak
Heating
Time
Recommended Soldering Conditions
Recommendations and precautions are described below.
● Please contact us regarding flow soldering.
● Recommended soldering conditions for reflow
· Reflow soldering shall be performed a maximum of
two times.
· Please contact us for additional information when
used in conditions other than those specified.
·Please measure the temperature of the terminals
and study every kind of solder and printed circuit
board for solderability before actual use.
Safety Precautions
The following are precautions for individual products. Please also refer to the precautions common to EMI Filters,
Fuses, and Sensors(MR Elements) shown on page EX2 of this catalog.
1. Take measures against mechanical stress during and after mounting of Chip Capacitor Networks (hereafter called the
capacitor networks) so as not to damage their electrodes and protective coatings.
Be careful not to misplace the capacitor networks on the land patterns. Otherwise, solder bridging may occur.
2. Do not use halogen-based or other high-activity flux. Otherwise, the residue may impair the capacitor networks'
performance and/or reliability.
3. Perform sufficient preheating so that the difference of the solder temperature and the capacitor networks chip surface
temperature becomes 100 °C or less. Maintain the temperature difference within 100 °C during rapid cooling by immersion
into solvent after soldering.
4. When soldering with a soldering iron, never touch the capacitor networks' bodies with the tip of the soldering iron.
When using a soldering iron with a high temperature tip, finish soldering as quickly as possible (within three seconds at
350 °C max.).
5. As the amount of applied solder becomes larger, the mechanical stress applied to the capacitor networks increases,
causing problems such as cracks and faulty characteristics. Avoid applying an excessive amounts of solder.
6. Do not apply shock to the capacitor networks or pinch them with a hard tool (e.g. pliers and tweezers). Otherwise, the
capacitor networks' protective coatings and bodies may be chipped, affecting their performance.
7. Avoid excessive bending of printed circuit boards in order to protect the capacitor networks from abnormal stress.
8. The static capacitance may decrease by a few percent from the time of shipment due to the characteristics peculiar to
dielectric materials having a high dielectric constant.
For soldering (Example : Sn/Pb)
Temperature
Time
Preheating
140 °C to 160 °C
60 s to 120 s
Main heating
Above 200 °C
30 s to 40 s
Peak
235 ± 5 °C
max. 10 s
For lead-free soldering (Example : Sn/Ag/Cu)
Temperature
Time
Preheating
150 °C to 180 °C
60 s to 120 s
Main heating
Above 230 °C
30 s to 40 s
Peak
max. 260 °C
max. 10 s
Feb. 2006


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