データシートサーチシステム |
|
KM416V1000B データシート(PDF) 8 Page - Samsung semiconductor |
|
KM416V1000B データシート(HTML) 8 Page - Samsung semiconductor |
8 / 8 page KM416C1000B, KM416C1200B CMOS DRAM KM416V1000B, KM416V1200B tASC, tCAH are referenced to the earlier CAS rising edge. tCP is specified from the last CAS rising edge in the previous cycle to the first CAS falling edge in the next cycle. tCWD is referenced to the later CAS falling edge at word read-modify-write cycle. tCWL is specified from W falling edge to the earlier CAS rising edge. tCSR is referenced to earlier CAS falling low before RAS transition low. tCHR is referenced to the later CAS rising high after RAS transition low. tCSR tCHR RAS LCAS UCAS 16. 15. 14. 11. 13. 12. 17. tDS, tDH is independently specified for lower byte DIN(0-7), upper byte DIN(8-15) 4096(4K Ref.)/1024(1K Ref.) of burst refresh must be executed within 16ms before and after self-refresh in order to meet refresh specification (L-version). 10. |
同様の部品番号 - KM416V1000B |
|
同様の説明 - KM416V1000B |
|
|
リンク URL |
プライバシーポリシー |
ALLDATASHEET.JP |
ALLDATASHEETはお客様のビジネスに役立ちますか? [ DONATE ] |
Alldatasheetは | 広告 | お問い合わせ | プライバシーポリシー | リンク交換 | メーカーリスト All Rights Reserved©Alldatasheet.com |
Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
Family Site : ic2ic.com |
icmetro.com |