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KM416V1000B データシート(PDF) 8 Page - Samsung semiconductor

部品番号 KM416V1000B
部品情報  1M x 16Bit CMOS Dynamic RAM with Fast Page Mode
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メーカー  SAMSUNG [Samsung semiconductor]
ホームページ  http://www.samsung.com/Products/Semiconductor
Logo SAMSUNG - Samsung semiconductor

KM416V1000B データシート(HTML) 8 Page - Samsung semiconductor

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KM416C1000B, KM416C1200B
CMOS DRAM
KM416V1000B, KM416V1200B
tASC, tCAH are referenced to the earlier CAS rising edge.
tCP is specified from the last CAS rising edge in the previous cycle to the first CAS falling edge in the next cycle.
tCWD is referenced to the later CAS falling edge at word read-modify-write cycle.
tCWL is specified from W falling edge to the earlier CAS rising edge.
tCSR is referenced to earlier CAS falling low before RAS transition low.
tCHR is referenced to the later CAS rising high after RAS transition low.
tCSR
tCHR
RAS
LCAS
UCAS
16.
15.
14.
11.
13.
12.
17.
tDS, tDH is independently specified for lower byte DIN(0-7), upper byte DIN(8-15)
4096(4K Ref.)/1024(1K Ref.) of burst refresh must be executed within 16ms before and after self-refresh in order to meet
refresh specification (L-version).
10.


同様の部品番号 - KM416V1000B

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同様の説明 - KM416V1000B

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