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FAN4860UC5X データシート(PDF) 3 Page - Fairchild Semiconductor |
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FAN4860UC5X データシート(HTML) 3 Page - Fairchild Semiconductor |
3 / 15 page © 2009 Fairchild Semiconductor Corporation www.fairchildsemi.com FAN4860 • Rev. 1.0.3 3 Absolute Maximum Ratings Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings are stress ratings only. Symbol Parameter Min. Max. Units VIN VIN Pin -0.3 5.5 V VOUT VOUT Pin –2 6 V VFB FB Pin –2 14 V VSW SW Node DC -0.3 5.5 V Transient: 10ns, 3MHz -1.0 6.5 VEN EN Pin -0.3 5.5 V ESD Electrostatic Discharge Protection Level Human Body Model per JESD22-A114 2.0 kV Charged Device Model per JESD22-C101 1.0 TJ Junction Temperature –40 +150 °C TSTG Storage Temperature –65 +150 °C TL Lead Soldering Temperature, 10 Seconds +260 °C Recommended Operating Conditions The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not recommend exceeding them or designing to absolute maximum ratings. Symbol Parameter Min. Max. Units VIN Supply Voltage 2.3 4.5 V IOUT Output Current 200 mA TA Ambient Temperature –40 +85 °C TJ Junction Temperature –40 +125 °C Thermal Properties Junction-to-ambient thermal resistance is a function of application and board layout. This data is measured with four-layer 2s2p boards in accordance to JEDEC standard JESD51. Special attention must be paid not to exceed junction temperature TJ(max) at a given ambient temperate TA. Symbol Parameter Typical Units θJA Junction-to-Ambient Thermal Resistance WLCSP 130 °C/W UMLP 57 °C/W |
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