ISL54200

2

FN6408.2

June 17, 2010

Pin Configurations

ISL54200

(10 LD TDFN)

TOP VIEW

ISL54200

(10 LD µTQFN)

TOP VIEW

NOTE:

1. ISL54200 Switches Shown for IN = Logic “0” and EN = Logic “1”.

Ordering Information

PART NUMBER

(Note 5)

PART

MARKING

TEMP. RANGE

(°C)

PACKAGE

(Pb-Free)

PKG.

DWG. #

ISL54200IRZ (Note 3)

200Z

-40 to +85

10 Ld 3x3 TDFN

L10.3x3A

ISL54200IRZ-T (Note 2, 3)

200Z

-40 to +85

10 Ld 3x3 TDFN Tape and Reel

L10.3x3A

ISL54200IRUZ-T (Note 2, 4) FM

-40 to +85

10 Ld 2.1mmx1.6mm μTQFN Tape and Reel

L10.2.1x1.6A

ISL54200EVAL1Z

Evaluation Board

NOTES:

2. Please refer to TB347 for details on reel specifications.

3. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach

materials, and 100% matte tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both

SnPb and Pb-free soldering operations). Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that

meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.

4. These Intersil Pb-free plastic packaged products employ special Pb-free material sets; molding compounds/die attach

materials and NiPdAu plate - e4 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free

soldering operations. Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed

the Pb-free requirements of IPC/JEDEC J STD-020.

5. For Moisture Sensitivity Level (MSL), please see device information page for

ISL54200. For more information on MSL please

see techbrief TB363.

VDD

IN

COMD2

COMD1

HSD2

GND

1

2

3

4

5

10

9

8

7

6 FSD2

FSD1

EN

HSD1

LOGIC

CONTROL

4M

PD

1

3

4

HSD1

COMD1

FSD1

IN 2

10

5

7

8

HSD2

COMD2

FSD2

9

6

VDD

LOGIC

CONTROL

4M

ISL54200