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ISL4270E データシート(PDF) 11 Page - Intersil Corporation |
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ISL4270E データシート(HTML) 11 Page - Intersil Corporation |
11 / 13 page 11 without allowing any latchup mechanism to activate, and don’t interfere with RS-232 signals as large as ±25V. Human Body Model (HBM) Testing As the name implies, this test method emulates the ESD event delivered to an IC during human handling. The tester delivers the charge through a 1.5k Ω current limiting resistor, making the test less severe than the IEC61000 test which utilizes a 330 Ω limiting resistor. The HBM method determines an ICs ability to withstand the ESD transients typically present during handling and manufacturing. Due to the random nature of these events, each pin is tested with respect to all other pins. The RS-232 pins on “E” family devices can withstand HBM ESD events to ±15kV. IEC61000-4-2 Testing The IEC61000 test method applies to finished equipment, rather than to an individual IC. Therefore, the pins most likely to suffer an ESD event are those that are exposed to the outside world (the RS-232 pins in this case), and the IC is tested in its typical application configuration (power applied) rather than testing each pin-to-pin combination. The lower current limiting resistor coupled with the larger charge storage capacitor yields a test that is much more severe than the HBM test. The extra ESD protection built into this device’s RS-232 pins allows the design of equipment meeting level 4 criteria without the need for additional board level protection on the RS-232 port. AIR-GAP DISCHARGE TEST METHOD For this test method, a charged probe tip moves toward the IC pin until the voltage arcs to it. The current waveform delivered to the IC pin depends on approach speed, humidity, temperature, etc., so it is difficult to obtain repeatable results. The “E” device RS-232 pins withstand ±15kV air-gap discharges. CONTACT DISCHARGE TEST METHOD During the contact discharge test, the probe contacts the tested pin before the probe tip is energized, thereby eliminating the variables associated with the air-gap discharge. The result is a more repeatable and predictable test, but equipment limits prevent testing devices at voltages higher than ±8kV. All “E” family devices survive ±8kV contact discharges on the RS-232 pins. Typical Performance Curves VCC = VL = 3.3V, TA = 25oC FIGURE 12. TRANSMITTER OUTPUT VOLTAGE vs LOAD CAPACITANCE FIGURE 13. SLEW RATE vs LOAD CAPACITANCE -6.0 -4.0 -2.0 0 2.0 4.0 6.0 1000 2000 3000 4000 5000 0 LOAD CAPACITANCE (pF) 1 TRANSMITTER AT 250kbps VOUT+ VOUT - OTHER TRANSMITTERS AT 30kbps LOAD CAPACITANCE (pF) 0 1000 2000 3000 4000 5000 -SLEW +SLEW 5 10 15 20 25 30 ISL4270E |
同様の部品番号 - ISL4270E |
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同様の説明 - ISL4270E |
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