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BTA208S-600B データシート(PDF) 5 Page - NXP Semiconductors |
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BTA208S-600B データシート(HTML) 5 Page - NXP Semiconductors |
5 / 13 page 9397 750 14861 © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Product data sheet Rev. 02 — 31 May 2005 5 of 13 Philips Semiconductors BTA208S-600B; BTA208S-800B Three-quadrant triacs high commutation 5. Thermal characteristics Table 4: Thermal characteristics Symbol Parameter Conditions Min Typ Max Unit Rth(j-mb) thermal resistance from junction to mounting base full cycle; see Figure 6 - - 2.0 K/W half cycle; see Figure 6 - - 2.4 K/W Rth(j-a) thermal resistance from junction to ambient printed-circuit board (FR4) mounted; footprint as in Figure 14 - 75 - K/W Fig 6. Transient thermal impedance from junction to mounting base as a function of pulse width 001aac673 tp (s) 10−5 110 10−1 10−2 10−4 10−3 1 10−1 10 Zth(j−mb) (K/W) 10−2 unidirectional bidirectional tp PD t |
同様の部品番号 - BTA208S-600B |
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