© Semiconductor Components Industries, LLC, 2009

August, 2009 − Rev. 3

1

Publication Order Number:

BCW70LT1/D

BCW70LT1G

General Purpose Transistor

PNP Silicon

Features

Compliant

MAXIMUM RATINGS

Rating

Symbol

Value

Unit

Collector−Emitter Voltage

−45

Vdc

Emitter−Base Voltage

−5.0

Vdc

Collector Current − Continuous

−100

mAdc

THERMAL CHARACTERISTICS

Characteristic

Symbol

Max

Unit

Total Device Dissipation FR-5 Board

Derate above 25°C

225

1.8

mW

mW/°C

Thermal Resistance, Junction−to−Ambient

556

°C/W

Total Device Dissipation Alumina

Derate above 25°C

300

2.4

mW

mW/°C

Thermal Resistance, Junction−to−Ambient

417

°C/W

Junction and Storage Temperature

°C

Stresses exceeding Maximum Ratings may damage the device. Maximum

Ratings are stress ratings only. Functional operation above the Recommended

Operating Conditions is not implied. Extended exposure to stresses above the

Recommended Operating Conditions may affect device reliability.

1. FR−5 = 1.0 x 0.75 x 0.062 in.

2. Alumina = 0.4 x 0.3 x 0.024 in. 99.5% alumina

Device

Package

ORDERING INFORMATION

SOT−23 (TO−236AB)

CASE 318

STYLE 6

MARKING DIAGRAM

H2 = Device Code

M

= Date Code*

G

= Pb−Free Package

1

2

3

COLLECTOR

3

1

BASE

2

EMITTER

http://onsemi.com

BCW70LT1G

SOT−23

(Pb−Free)

3000 / Tape & Reel

†For information on tape and reel specifications,

including part orientation and tape sizes, please

refer to our Tape and Reel Packaging Specifications

Brochure, BRD8011/D.

(Note: Microdot may be in either location)

1

H2 M G

G

*Date Code orientation and/or overbar may vary

depending upon manufacturing location.