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IRLML6401GPBF データシート(PDF) 1 Page - International Rectifier

部品番号 IRLML6401GPBF
部品情報  HEXFETPower MOSFET
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メーカー  IRF [International Rectifier]
ホームページ  http://www.irf.com
Logo IRF - International Rectifier

IRLML6401GPBF データシート(HTML) 1 Page - International Rectifier

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Parameter
Typ.
Max.
Units
RθJA
Maximum Junction-to-Ambient
ƒ
75
100
°C/W
IRLML6401GPbF
HEXFET® Power MOSFET
Thermal Resistance
VDSS = -12V
RDS(on) = 0.05Ω
l Ultra Low On-Resistance
l P-Channel MOSFET
l SOT-23 Footprint
l Low Profile (<1.1mm)
l Available in Tape and Reel
l Fast Switching
l 1.8V Gate Rated
l Lead-Free
l Halogen-Free
07/22/08
www.irf.com
1
Parameter
Max.
Units
VDS
Drain- Source Voltage
-12
V
ID @ TA = 25°C
Continuous Drain Current, VGS @ -4.5V
-4.3
ID @ TA= 70°C
Continuous Drain Current, VGS @ -4.5V
-3.4
A
IDM
Pulsed Drain Current

-34
PD @TA = 25°C
Power Dissipation
1.3
PD @TA = 70°C
Power Dissipation
0.8
Linear Derating Factor
0.01
W/°C
EAS
Single Pulse Avalanche Energy
„
33
mJ
VGS
Gate-to-Source Voltage
± 8.0
V
TJ, TSTG
Junction and Storage Temperature Range
-55 to + 150
°C
Absolute Maximum Ratings
W
These P-Channel MOSFETs from International Rectifier
utilize advanced processing techniques to achieve extremely
low on-resistance per silicon area. This benefit, combined
with the fast switching speed and ruggedized device design
that HEXFET® power MOSFETs are well known for, provides
the designer with an extremely efficient and reliable device
for use in battery and load management.
A thermally enhanced large pad leadframe has been
incorporated into the standard SOT-23 package to produce
a HEXFET Power MOSFET with the industry's smallest
footprint. This package, dubbed the Micro3
™, is ideal for
applications where printed circuit board space is at a
premium. The low profile (<1.1mm) of the Micro3 allows it
to fit easily into extremely thin application environments
such as portable electronics and PCMCIA cards. The thermal
resistance and power dissipation are the best available.
Description
Micro3
6
* 

'

PD - 96160


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