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ISL33001IRT2Z データシート(PDF) 4 Page - Intersil Corporation

部品番号 ISL33001IRT2Z
部品情報  I2C Bus Buffer with Rise Time Accelerators and Hot Swap Capability
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メーカー  INTERSIL [Intersil Corporation]
ホームページ  http://www.intersil.com/cda/home
Logo INTERSIL - Intersil Corporation

ISL33001IRT2Z データシート(HTML) 4 Page - Intersil Corporation

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4
FN7560.2
September 30, 2010
Absolute Maximum Ratings
(All voltages referenced to GND)
Thermal Information
VCC1, VCC2 . . . . . . . . . . . . . . . . . . . . . . . . . .-0.3V to +7V
SDA_IN, SCL_IN . . . . . . . . . . . . . -0.3V to +(VCC1 + 0.3)V
SDA_OUT, SCL_OUT . . . . . . . . . . . -0.3V to +(VCC2 + 0.3)V
ENABLE, READY, ACC . . . . . . . . . . -0.3V to +(VCC1 + 0.3)V
Maximum Sink Current (SDA and SCL Pins). . . . . . . . . 20mA
Maximum Sink Current (READY pin) . . . . . . . . . . . . . . .7mA
Latch-Up Tested per JESD78, Level 2, Class A . . . . . . . 85°C
ESD Ratings. . . . . . . . . . See “ESD PROTECTION” on page 5
Thermal Resistance
θJA (°C/W) θJC (°C/W)
8 Ld TDFN Package (Notes 5, 6) . . .
47
4
(0.50mm Pitch)
8 Ld TDFN Package (Notes 5, 6) . . .
48
6
(0.65mm Pitch)
8 Ld MSOP Package (Notes 4, 7) . . .
151
50
8 Ld SOIC Package (Notes 4, 7). . . .
120
56
Maximum Storage Temperature Range . . . -65°C to +150°C
Maximum Junction Temperature . . . . . . . . . . . . . . . +150°C
Pb-free Reflow Profile . . . . . . . . . . . . . . . . . .see link below
http://www.intersi.com/pbfree/Pb-FreeReflow.asp
Operating Conditions
Temperature Range, TA . . . . . . . . . . . . . . . -40°C to +85°C
VCC1 and VCC2 Supply Voltage Range . . . . . +2.3V to +5.5V
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact
product reliability and result in failures not covered by warranty.
NOTES:
4. θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief
TB7379 for details.
5. θJA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach”
features. See Tech Brief TB379.
6. For θJC, the “case temp” location is the center of the exposed metal pad on the package underside.
7. For θJC, the “case temp” location is taken at the package top center.
Electrical Specifications VEN = VCC1, VCC1 = +2.3V to +5.5V, VCC2 = +2.3V to +5.5V, unless otherwise noted (Note 8).
Boldface limits apply over the operating temperature range,
-40°C to +85°C.
PARAMETER
SYMBOL
CONDITIONS
TEMP
(°C)
MIN
(Note 9)
TYP
MAX
(Note 9) UNITS
POWER SUPPLIES
VCC1 Supply Range
VCC1
Full
2.3
-
5.5
V
VCC2 Supply Range
VCC2
ISL33002 and ISL33003
Full
2.3
-
5.5
V
Supply Current from
VCC1
ICC1
VCC1 = 5.5V; ISL33001 only (Note 11)
Full
-
2.1
4.0
mA
VCC1 = VCC2 = 5.5V; ISL33002 and
ISL33003 (Note 11)
Full
-
2.0
3.0
mA
Supply Current from
VCC2
ICC2
VCC2 = VCC = 5.5V; ISL33002 and
ISL33003 (Note 11)
Full
-
0.22
0.6
mA
VCC1 Shut-down
Supply Current
ISHDN1
VCC1 = 5.5V, VEN = GND; ISL33001 only Full
-
0.5
-
µA
VCC1 = VCC2 = 5.5V, VEN = GND;
ISL33003 only
Full
-
0.05
-
µA
VCC2 Shut-down
Supply Current
ISHDN2
VCC1 = VCC2 = 5.5V, VEN = GND,
ISL33003 only
Full
-
0.06
-
µA
START-UP CIRCUITRY
Precharge Circuitry
Voltage
VPRE
SDA and SCL pins floating
Full
0.8
1
1.2
V
Enable High Threshold
Voltage
VEN_H
+25
-
0.5*VCC 0.7*VCC
V
Enable Low Threshold
Voltage
VEN_L
+25
0.3*VCC 0.5*VCC
-V
Enable Pin Input
Current
IEN
Enable from 0V to VCC1; ISL33001 and
ISL33003
Full
-1
0.1
1
µA
ISL33001, ISL33002, ISL33003


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