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FAN5343 データシート(PDF) 4 Page - Fairchild Semiconductor

部品番号 FAN5343
部品情報  6-LED Series Boost LED Driver with Integrated Schottky Diode and Single-Wire Digital Interface
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メーカー  FAIRCHILD [Fairchild Semiconductor]
ホームページ  http://www.fairchildsemi.com
Logo FAIRCHILD - Fairchild Semiconductor

FAN5343 データシート(HTML) 4 Page - Fairchild Semiconductor

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© 2009 Fairchild Semiconductor Corporation
www.fairchildsemi.com
FAN5343 • Rev. 1.0.4
4
Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable
above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition,
extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute
maximum ratings are stress ratings only.
Symbol
Parameter
Min.
Max.
Units
VIN
Voltage on VIN Pin
–0.3
6.0
V
VFB, VEN
Voltage on FB and EN Pins
–0.3
VIN + 0.3
V
VSW
Voltage on SW Pin
–0.3
25
V
VOUT
Voltage on VOUT Pin
–0.3
25
V
ESD
Electrostatic Discharge Protection Level
Human Body Model per
JESD22-A114
3.3
kV
Charged Device Model
per JESD22-C101
2.0
TJ
Junction Temperature
–40
+150
°C
TSTG
Storage Temperature
–65
+150
°C
TL
Lead Soldering Temperature, 10 Seconds
+260
°C
Recommended Operating Conditions
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended operating
conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not recommend
exceeding them or designing to absolute maximum ratings.
Symbol
Parameter
Conditions
Min.
Max.
Units
VIN
VIN Supply Voltage
2.7
5.5
V
VOUT
VOUT Voltage
(1)
6.2
24.0
V
IOUT
VOUT Load Current
500mW Maximum Output Power
5
25
mA
TA
Ambient Temperature
–40
+85
°C
TJ
Junction Temperature
–40
+125
°C
Note:
1.
Application should guarantee that minimum and maximum duty-cycle should fall between 20-85% to meet the specified
range.
Thermal Properties
Junction-to-ambient thermal resistance is a function of application and board layout. This data is measured with four-layer
2s2p boards in accordance to JEDEC standard JESD51. Special attention must be paid not to exceed junction temperature
TJ(max) at a given ambient temperate TA.
Symbol
Parameter
Typical
Units
θJA
Junction-to-Ambient Thermal Resistance
70
°C/W


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