データシートサーチシステム |
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LM3464MHX データシート(PDF) 4 Page - National Semiconductor (TI) |
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LM3464MHX データシート(HTML) 4 Page - National Semiconductor (TI) |
4 / 22 page Pin Name Description Application Information 20 SE4 Channel 4 sense input Connect to an external sense resistor to define the Channel 4 LED current. 21 GD4 Channel 4 gate driver output Connect to the gate of external NMOS to control the channel 4 LED current. 22 PGND Power Ground Ground for power circuitry. Reference point for all stated voltages. Must be externally connected to EP and AGND 23 GD3 Channel 3 gate driver output Connect to the gate of external NMOS to control the channel 3 LED current. 24 SE3 Channel 3 sense input Connect to an external sense resistor to define the Channel 3 LED current. 25 GD2 Channel 2 gate driver output Connect to the gate of external NMOS to control the channel 2 LED current. 26 SE2 Channel 2 sense input Connect to an external sense resistor to define the Channel 2 LED current. 27 GD1 Channel 1 gate driver output Connect to the gate of external NMOS to control the channel 1 LED current. 28 SE1 Channel 1 sense input Connect to an external sense resistor to define the Channel 1 LED current. EP EP Thermal Pad (Power Ground) Used to dissipate heat from the package during operation. Must be electrically connected to PGND external to the package. www.national.com 4 |
同様の部品番号 - LM3464MHX |
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同様の説明 - LM3464MHX |
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