1SS400T1G

http://onsemi.com

3

PACKAGE DIMENSIONS

SOD−523

CASE 502−01

ISSUE D

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M,

1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH

THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM

THICKNESS OF BASE MATERIAL.

−T−

SEATING

PLANE

E

D

−X−

−Y−

b

2X

T

M

0.08 (0.003)

X

Y

A

H

c

L

DIM

MIN

NOM

MAX

MILLIMETERS

D

1.10

1.20

1.30

E

0.70

0.80

0.90

A

0.50

0.60

0.70

b

0.25

0.30

0.35

c

0.07

0.14

0.20

L

0.15

0.20

0.25

H

1.50

1.60

1.70

0.043

0.047

0.051

0.028

0.032

0.035

0.020

0.024

0.028

0.010

0.012

0.014

0.0028

0.0055

0.0079

0.006

0.008

0.010

0.059

0.063

0.067

MIN

NOM

MAX

INCHES

12

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

0.40

0.0157

0.40

0.0157

1.40

0.0547

mm

inches

SCALE 10:1

E

E

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“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All

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