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BU24033GW データシート(PDF) 3 Page - Rohm |
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BU24033GW データシート(HTML) 3 Page - Rohm |
3 / 4 page 3/3 REV. A ◇Pin functions ◇Outline dimensions/Marking figure Land Matrix No. Pin name Power supply Function E6 DVDD - Digital power supply D6 DVDDIO - I/O power supply F6 DVSS - ground A6 FCLK DVDDIO FCLK logic input E2 CSB DVDDIO CSB logic input F4 SCLK DVDDIO SCLK logic input F3 SDATA DVDDIO SDATA logic input F2 SOUT DVDDIO SOUT logic output D2 IN6 / IN5A DVDDIO IN6 / IN5A logic input B5 STATE1 DVDDIO STATE1 logic input/output B4 STATE2 DVDDIO STATE2 logic input/output G1 TEST DVDDIO TEST logic output E7 PIOUT1 DVDD PI driving output 1 G7 PIOUT2 DVDD PI driving output 2 B3 SI1 DVDD Waveforming input1 B2 SO1 DVDD Waveforming output1 D7 SI2 DVDD Waveforming input2 F7 SO2 DVDD Waveforming output2 F5 SI3 / IN5B DVDD Waveforming input3 / IN5B logic input C2 SO3 DVDD Waveforming output3 A2 MVCC12 - 1ch, 2ch Driver power supply A4 MGND126 - 1ch, 2ch, 6ch Driver ground A1 OUT1A MVCC12 1ch Driver A output B1 OUT1B MVCC12 1ch Driver B output A3 OUT2A MVCC12 2ch Driver A output A5 OUT2B MVCC12 2ch Driver B output G5 MVCC34 - 3ch, 4ch Driver power supply F1 MGND345 - 3ch, 4ch, 5ch Driver ground G6 OUT3A MVCC34 3ch Driver A output G4 OUT3B MVCC34 3ch Driver B output G3 OUT4A MVCC34 4ch Driver A output G2 OUT4B MVCC34 4ch Driver B output D1 MVCC5 - 5ch Driver power supply C1 OUT5A MVCC5 5ch Driver A output E1 OUT5B MVCC5 5ch Driver B output C6 VDDAMP - 6ch Power supply of current driver control A7,B6 RNF6 - 6ch Driver power supply C7 OUT6A RNF6 6ch Driver A output B7 OUT6B RNF6 6ch Driver B output ◇Pin assignment diagram (bottom view) ◇Cautions on use (1)Absolute maximum ratings If applied voltage, operating temperature range, or other absolute maximum ratings are exceeded, the LSI may be damaged. Do not apply voltages or temperatures that exceed the absolute maximum ratings. If you expect that any voltage or temperature could be exceeding the absolute maximum ratings, take physical safety measures such as fuses to prevent any conditions exceeding the absolute maximum ratings from being applied to the LSI. (2)GND potential Maintain the GND pin at the minimum voltage even under any operating conditions. Actually check to be sure that none of the pins have voltage lower than that of GND pin, including transient phenomena. (3)Thermal design With consideration given to the permissible dissipation under actual use conditions, perform thermal design so that adequate margins will be provided. (4)Short circuit between pins and malfunctions To mount the LSI on a board, pay utmost attention to the orientation and displacement of the LSI. Faulty mounting to apply a voltage to the LSI may cause damage to the LSI. Furthermore, the LSI may also be damaged if any foreign matters enter between pins, between pin and power supply, or between pin and GND of the LSI. (5)Operation in strong magnetic field Make a thorough evaluation on use of the LSI in a strong magnetic field. Not doing so may malfunction the LSI. TEST OUT4B OUT4A OUT3B MVCC34 OUT3A PIOUT2 MGND345 SOUT SDATA SCLK SI3/IN5B DVSS SO2 OUT5B CSB DVDD PIOUT1 MVCC5 IN6/IN5A DVDDIO SI2 OUT5A SO3 VDDAMP OUT6A OUT1B SO1 SI1 STATE2 STATE1 RNF6 OUT6B OUT1A MVCC12 OUT2A MGND126 OUT2B FCLK RNF6 B G F E D 67 A 12345 C Lot No. U24033 UCSP75M3 |
同様の部品番号 - BU24033GW |
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同様の説明 - BU24033GW |
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