5

1

V

CC

D

DBV PACKAGE

(TOP VIEW)

2

CLK

3

4

GND

Q

DCK PACKAGE

(TOP VIEW)

2

CLK

3

4

GND

V

CC

5

D

Q

1

DRY PACKAGE

(TOP VIEW)

CLK

NC

D

6

5

4

2

3

GND

Q

V

CC

1

GND

Q

3

4

CLK

2

5

D

6

1

N.C.

V

CC

DSF PACKAGE

(TOP VIEW)

YZP PACKAGE

(TOP VIEW)

GND

D

Q

V

CC

CLK

3

5

2

1

4

A1

B1

C1

A2

C2

YFP PACKAGE

(TOP VIEW)

GND

D

Q

V

CC

CLK

3

6

2

1

4

5

N.C.

A1

B1

C1

A2

B2

C2

SN74AUP1G80

www.ti.com

SCES593E – JULY 2004 – REVISED MAY 2010

LOW-POWER SINGLE POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOP

Check for Samples: SN74AUP1G80

1

FEATURES

•

Available in the Texas Instruments NanoStar™

•

Package

•

Optimized for 3.3-V Operation

•

Low Static-Power Consumption

•

3.6-V I/O Tolerant to Support Mixed-Mode

Signal Operation

•

Low Dynamic-Power Consumption

•

•

Suitable for Point-to-Point Applications

•

•

Latch-Up Performance Exceeds 100 mA Per

•

Low Noise – Overshoot and Undershoot <10%

JESD 78, Class II

•

ESD Performance Tested Per JESD 22

•

–

2000-V Human-Body Model

Operation

(A114-B, Class II)

•

Schmitt-Trigger Action Allows Slow Input

–

1000-V Charged-Device Model (C101)

Transition and Better Switching Noise

Immunity at the Input

See mechanical drawings for dimensions.

N.C. – No internal connection

DESCRIPTION/ORDERING INFORMATION

The AUP family is TI's premier solution to the industry's low-power needs in battery-powered portable

of 0.8 V to 3.6 V, resulting in increased battery life (see Figure 1). This product also maintains excellent signal

integrity (see Figure 2).

1

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas

Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

PRODUCTION DATA information is current as of publication date.

Copyright © 2004–2010, Texas Instruments Incorporated

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.