© 2010 Fairchild Semiconductor Corporation

www.fairchildsemi.com

FAN3850A • Rev. 3.0.6

10

Physical Dimensions

Figure 11. 6-Ball, Wafer-Level Chip-Scale Package (WLCSP)

FAN3850A External Product Dimensions

Product ID

D

E

X

Y

All options

1.260mm

0.860mm

0.145mm

0.145mm

Ball Composition: SN97.5-Ag2.5

Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner

without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify

or obtain the most recent version. Package specifications do not expand Fairchild’s worldwide terms and conditions, specifically the

warranty therein, which covers Fairchild products.

Always visit Fairchild Semiconductors online packaging area for the most recent packaging drawings and tape and reel

.

BOTTOM VIEW

TOP VIEW

1

2

A

B

C

6X

0.005

C A B

(X) +/-0.018

(Y) +/-0.018

Ø0.120±0.010

F

E

D

B

A

PIN A1

AREA

F

2X

2X

(Ø0.120)

CU PAD

SIDE VIEWS

0.06 C

D

C

SEATING

PLANE

0.03 C

0.03 C

NOTES:

A. NO JEDEC REGISTRATION APPLIES.

B. DIMENSIONS ARE IN MILLIMETERS.

C. DIMENSIONS AND TOLERANCES PER

ASME Y14.5M, 1994.

D. DATUM C, THE SEATING PLANE IS DEFINED

BY THE SPHERICAL CROWNS OF THE BALLS.

E. PACKAGE TYPICAL HEIGHT IS 273 MICRONS

±23 MICRONS (254-300 MICRONS).

F. FOR DIMENSIONS D, E, X, AND Y SEE

PRODUCT DATASHEET.

G. DRAWING FILENAME: UC006AHrev3.

E

0.080±0.010

0.570

0.485

0.197±0.013

0.300

0.254

0.570

0.485

RECOMMENDED LAND

PATTERN (NSMD)

(Ø0.220)

SOLDER MASK

A1

0.01 C