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U-DFN3030-8 データシート(PDF) 11 Page - Diodes Incorporated |
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U-DFN3030-8 データシート(HTML) 11 Page - Diodes Incorporated |
11 / 27 page ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. AP02001 Rev. 52 11 of 27 www.diodes.com Suggested Pad Layout © Diodes Incorporated U-DFN4030-12 Dimensions Value (in mm) C 0.500 X 0.300 X1 2.800 X2 3.350 Y 0.600 Y1 1.750 Y2 3.400 U-DFN4030-12 Type B Dimensions Value (in mm) C 0.500 X 0.350 X1 1.160 X2 0.900 X3 1.720 X4 0.850 X5 3.700 Y 0.700 Y1 0.870 Y2 0.500 Y3 0.550 Y4 0.350 Y5 1.710 Y6 0.940 Y7 3.300 Pin1 C X (12x) Y1 Y2 Y (12x) X2 X1 Y7 X5 C X (12X) Y5 (2x) X1(2x) X3 (2x) Y Y3 X2 Y6 Y2 Y4 X4 1 Y1 |
同様の部品番号 - U-DFN3030-8 |
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同様の説明 - U-DFN3030-8 |
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