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CDCEL913IPWRQ1 データシート(PDF) 4 Page - Texas Instruments |
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CDCEL913IPWRQ1 データシート(HTML) 4 Page - Texas Instruments |
4 / 26 page CDCEL913-Q1 SCAS888 – SEPTEMBER 2009 www.ti.com ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range (unless otherwise noted) (1) VALUE UNIT VDD Supply voltage range –0.5 to 2.5 V VI Input voltage range(2) (3) –0.5 to VDD + 0.5 V VO Output voltage range(2) –0.5 to VDD + 0.5 V II Input current (VI < 0, VI > VDD) 20 mA IO Continuous output current 50 mA Tstg Storage temperature range –65 to 150 °C TJ Maximum junction temperature 125 °C (1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) The input and output negative voltage ratings may be exceeded if the input and output clamp-current ratings are observed. (3) SDA and SCL can go up to 3.6V as stated in the Recommended Operating Conditions table. PACKAGE THERMAL RESISTANCE (1) (2) over operating free-air temperature range (unless otherwise noted) AIRFLOW TSSOP14 PARAMETER (lfm) °C/W 0 106 150 93 RθJA Thermal resistance, junction to ambient 200 92 250 90 500 85 RθJC Thermal resistance, junction to case — 43 RθJB Thermal resistance, junction to board — 66 RθJT Thermal resistance, junction to top — 1.4 RθJB Thermal resistance, junction to bottom — 62 (1) The package thermal impedance is calculated in accordance with JESD 51 and JEDEC2S2P (high-k board). (2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. 4 Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): CDCEL913-Q1 |
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