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MMA8652FCR1 データシート(PDF) 69 Page - Freescale Semiconductor, Inc |
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MMA8652FCR1 データシート(HTML) 69 Page - Freescale Semiconductor, Inc |
69 / 77 page MMA8652FC Sensors Freescale Semiconductor, Inc. 69 7 Mounting Guidelines Surface mount printed circuit board (PCB) layout is a critical portion of the total design. The footprint for the surface mount packages must be the correct size to ensure proper solder connection interface between the PCB and the package. With the correct footprint, the packages will self-align when subjected to a solder reflow process. These guidelines are for soldering and mounting the Dual Flat No-Lead (DFN) package inertial sensors to PCBs. The purpose is to minimize the stress on the package after board mounting. The MMA865xFC digital output accelerometers use the DFN package platform. This section describes suggested methods of soldering these devices to the PCB for consumer applications. 7.1 Overview of soldering considerations Information provided here is based on experiments executed on DFN devices. They do not represent exact conditions present at a customer site. Therefore, this information should be used as guidance only and process and design optimizations are recommended to develop an application specific solution. It should be noted that with the proper PCB footprint and solder stencil designs, the package will self-align during the solder reflow process. 7.2 Halogen content This package is designed to be Halogen Free, exceeding most industry and customer standards. Halogen Free means that no homogeneous material within the assembly package shall contain chlorine (Cl) in excess of 700 ppm or 0.07% weight/weight or bromine (Br) in excess of 900 ppm or 0.09% weight/weight. 7.3 PCB mounting/soldering recommendations 1. The PCB land should be designed as Non Solder Mask Defined (NSMD) as shown in Figure 62. 2. No additional via pattern underneath package. 3. PCB land pad is 0.6 mm x 0.225 mm as shown in Figure 62. 4. Solder mask opening = PCB land pad edge + 0.125 mm larger all around = 0.725 mm x 1.950 mm 5. Stencil opening = PCB land pad -0.05 mm smaller all around = 0.55 mm x 0.175 mm. 6. Stencil thickness is 100 or 125 um. 7. Do not place any components or vias at a distance less than 2 mm from the package land area. This may cause additional package stress if it is too close to the package land area. 8. Signal traces connected to pads are as symmetric as possible. Put dummy traces on NC pads, to have same length of exposed trace for all pads. 9. Use a standard pick and place process and equipment. Do not use a hand soldering process. 10. Use caution when putting an assembled PCB into an enclosure, noting where the screw-down holes are and if any press-fitting is involved. It is important that the assembled PCB remain flat after assembly, to ensure optimal electronic operation of the device. 11. The PCB should be rated for the multiple lead-free reflow condition with max 260°C temperature. 12. No copper traces on top layer of PCB under the package. This will cause planarity issues with board mount. Freescale DFN sensors are compliant with Restrictions on Hazardous Substances (RoHS), having halide free molding compound (green) and lead-free terminations. These terminations are compatible with tin-lead (Sn-Pb) as well as tin-silver-copper (Sn-Ag-Cu) solder paste soldering processes. Reflow profiles applicable to those processes can be used successfully for soldering the devices. |
同様の部品番号 - MMA8652FCR1 |
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同様の説明 - MMA8652FCR1 |
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