DAC1617D1G0 datasheet(2/78 Pages) IDT

部品番号	DAC1617D1G0

部品情報	Dual 16-bit DAC, LVDS interface, up to 1 Gsps, x2, x4 and x8 interpolating

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メーカー	IDT [Integrated Device Technology]

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2 / 78 page

DAC1617D1G0 3

Preliminary data sheet

Rev. 03 — 2 July 2012

2 of 78

Integrated Device Technology

DAC1617D1G0

Dual 16-bit DAC: up to 1 Gsps; x2, x4 and x8 interpolating

3. Applications



Wireless infrastructure: LTE, WiMAX, GSM, CDMA, WCDMA, TD-SCDMA



Communications: LMDS/MMDS, point-to-point



Direct Digital Synthesis (DDS)



Broadband wireless systems



Digital radio links



Instrumentation



Automated Test Equipment (ATE)

4. Ordering information



Embedded Numerically Controlled

Oscillator (NCO) with 40-bit

programmable frequency



High resolution internal digital gain and

offset control to support high

performance IQ-modulator image

rejection



Embedded complex(I/Q) digital IF

modulator



Internal phase correction



1.8 V and 3.3 V power supplies



Inverse (sin x) / x function



LVDS DDR compatible input interface

with on-chip 100

 terminations



Power-down mode and Sleep mode;

5-bit NCO low-power mode



LVDS DDR input clock up to 370 MHz



On-chip 1.25 V reference



LVDS or LVPECL compatible DAC clock  Industrial temperature range

40 C to

+85

C



Interleaved or folded I and Q data input

mode



72 pins small form factor HVQFN

package

Table 1.

Ordering information

Type number

Package

Name

Description

Version

DAC1617D1G0HN HVQFN72

plastic thermal enhanced very thin quad flat package; no leads;

72 terminals; body 10

 10  0.85 mm

SOT813-3

同様の部品番号 - DAC1617D1G0

メーカー	部品番号	データシート	部品情報
Renesas Technology Corp	DAC1617D1G0	857Kb / 78P	Dual 16-bit DAC, LVDS interface, up to 1 Gsps, x2, x4 and x8 interpolating 12 December 2012
Renesas Technology Corp	DAC1617D1G0HN	857Kb / 78P	Dual 16-bit DAC, LVDS interface, up to 1 Gsps, x2, x4 and x8 interpolating 12 December 2012

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同様の説明 - DAC1617D1G0

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