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SN74LV374 データシート(PDF) 1 Page - Texas Instruments |
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SN74LV374 データシート(HTML) 1 Page - Texas Instruments |
1 / 11 page SN54LV374, SN74LV374 OCTAL EDGETRIGGERED DTYPE FLIPFLOPS WITH 3STATE OUTPUTS SCLS197B − FEBRUARY 1993 − REVISED APRIL 1996 1 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251−1443 D EPIC (Enhanced-Performance Implanted CMOS) 2- µ Process D Typical VOLP (Output Ground Bounce) < 0.8 V at VCC, TA = 25°C D Typical VOHV (Output VOH Undershoot) > 2 V at VCC, TA = 25°C D ESD Protection Exceeds 2000 V Per MIL-STD-883C, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0) D Latch-Up Performance Exceeds 250 mA Per JEDEC Standard JESD-17 D Package Options Include Plastic Small-Outline (DW), Shrink Small-Outline (DB), Thin Shrink Small-Outline (PW), Ceramic Flat (W) Packages, Chip Carriers (FK), and (J) 300-mil DIPs description These octal edge-triggered D-type flip-flops are designed for 2.7-V to 5.5-V VCC operation. The ’LV374 feature 3-state outputs designed specifically for driving highly capacitive or relatively low-impedance loads. These devices are particularly suitable for implementing buffer registers, I/O ports, bidirectional bus drivers, and working registers. On the positive transition of the clock (CLK) input, the Q outputs are set to the logic levels set up at the data (D) inputs. A buffered output-enable (OE) input can be used to place the eight outputs in either as normal logic state (high or low logic levels) or high-impedance state. In the high-impedance state, the outputs neither load nor drive the bus lines significantly. The high-impedance state and the increased drive provide the capability to drive bus lines without need for interface or pullup components. OE does not affect internal operations of the latch. Old data can be retained or new data can be entered while the outputs are in the high-impedance state. The SN74LV374 is available in TI’s shrink small-outline package (DB), which provides the same I/O pin count and functionality of standard small-outline packages in less than half the printed-circuit-board area. The SN54LV374 is characterized for operation over the full military temperature range of −55 °C to 125°C. The SN74LV374 is characterized for operation from −40 °C to 85°C. Copyright 1996, Texas Instruments Incorporated UNLESS OTHERWISE NOTED this document contains PRODUCTION DATA information current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. EPIC is a trademark of Texas Instruments Incorporated. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. 32 1 20 19 910 11 1213 4 5 6 7 8 18 17 16 15 14 8D 7D 7Q 6Q 6D 2D 2Q 3Q 3D 4D SN54LV374 . . . FK PACKAGE (TOP VIEW) SN54LV374 ...J OR W PACKAGE SN74LV374 . . . DB, DW, OR PW PACKAGE (TOP VIEW) 1 2 3 4 5 6 7 8 9 10 20 19 18 17 16 15 14 13 12 11 OE 1Q 1D 2D 2Q 3Q 3D 4D 4Q GND VCC 8Q 8D 7D 7Q 6Q 6D 5D 5Q CLK |
同様の部品番号 - SN74LV374 |
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同様の説明 - SN74LV374 |
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