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データシートサーチシステム |
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データシートサーチシステム |
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CXA1875AP データシート(PDF) 10 Page - Sony Corporation |
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CXA1875AP データシート(HTML) 10 Page - Sony Corporation |
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10 / 10 page  PACKAGE STRUCTURE PACKAGE MATERIAL LEAD TREATMENT LEAD MATERIAL PACKAGE MASS EPOXY RESIN SOLDER PLATING COPPER ALLOY 19.2 – 0.1 + 0.4 9 1 8 2.54 0.5 ± 0.1 1.2 ± 0.15 0° to 15° 16 16PIN DIP (PLASTIC) 1.0 g SONY CODE EIAJ CODE JEDEC CODE DIP-16P-01 DIP016-P-0300 Similar to MO-001-AE 1.All mat surface type. Two kinds of package surface: 2.All mirror surface type. PACKAGE STRUCTURE PACKAGE MATERIAL LEAD TREATMENT LEAD MATERIAL PACKAGE MASS SONY CODE EIAJ CODE JEDEC CODE SOP-16P-L01 SOP016-P-0300 COPPER ALLOY SOLDER PLATING EPOXY RESIN 16PIN SOP (PLASTIC) 9.9 – 0.1 + 0.4 16 9 1 8 1.27 0.45 ± 0.1 1.85 – 0.15 + 0.4 0.2 – 0.05 + 0.1 0.1 – 0.05 + 0.2 0.2g 0.15 M 0.24 Package Outline Unit : mm CXA1875AP CXA1875AM CXA1875AP/AM —10— Purchase of Sony’s I2C components conveys a license under the Philips I2C Patent Rights to use these components in an I2C system, provided that the system conforms to the I2C Standard Specifications as defined by Philips. |
同様の部品番号 - CXA1875AP |
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同様の説明 - CXA1875AP |
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