CS8182

http://onsemi.com

11

PACKAGE DIMENSIONS

DP SUFFIX

CASE 936AC

ISSUE A

DIM

MIN

MAX

MIN

MAX

MILLIMETERS

INCHES

E

0.380

0.420

9.65

10.67

D1

0.250

−−−

6.35

−−−

A

0.170

0.180

4.32

4.57

b

0.026

0.036

0.66

0.91

c2

0.045

0.055

1.14

1.40

e

0.067 BSC

1.70 BSC

H

0.580

0.620

14.73

15.75

L1

−−−

0.066

−−−

1.68

A1

0.000

0.010

0.00

0.25

c

0.017

0.026

0.43

0.66

E

D

H

L1

b

e

D1

E1

L

0.090

0.110

2.29

2.79

M

0

8

L3

0.010 BSC

0.25 BSC

__

0

8

__

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

RECOMMENDED

DIMENSIONS: MILLIMETERS

0.424

5X

0.584

0.310

0.176

0.040

0.067

PITCH

SOLDERING FOOTPRINT*

A1

L3

B

H

L

M

DETAIL C

SEATING

PLANE

GAUGE

PLANE

NOTES:

1. DIMENSIONING AND TOLERANCING PER ASME

Y14.5M, 1994.

2. CONTROLLING DIMENSION: INCHES.

3. DIMENSIONS D AND E DO NOT INCLUDE MOLD

FLASH AND GATE PROTRUSIONS. MOLD FLASH

AND GATE PROTRUSIONS NOT TO EXCEED

0.005 MAXIMUM PER SIDE. THESE DIMENSIONS

TO BE MEASURED AT DATUM H.

4. THERMAL PAD CONTOUR OPTIONAL WITHIN

DIMENSIONS E, L1, D1, AND E1. DIMENSIONS

D1 AND E1 ESTABLISH A MINIMUM MOUNTING

SURFACE FOR THE THERMAL PAD.

E1

0.200

−−−

5.08

−−−

D

0.325

0.368

8.25

9.53

A

5X

M

A

M

0.13

B

E/2

c2

c

A

PLANE

A

A

DETAIL C

M

A

M

0.10

B

VIEW A−A