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TMP47C103MG データシート(PDF) 3 Page - Toshiba Semiconductor |
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TMP47C103MG データシート(HTML) 3 Page - Toshiba Semiconductor |
3 / 55 page TMP47C103/203 II 2008-03-06 1. Part number 2. Package code and dimensions Previous Part Number (in Body Text) Previous Package Code (in Body Text) New Part Number New Package Code OTP TMP47C103N P-SDIP28-400-1.78 TMP47C103NG SDIP28-P-400-1.78 TMP47P403VNG TMP47C103M P-SOP28-450-1.27 TMP47C103MG SOP28-P-450-1.27B TMP47P403VMG TMP47C203N P-SDIP28-400-1.78 TMP47C203NG SDIP28-P-400-1.78 TMP47P403VNG TMP47C203M P-SOP28-450-1.27 TMP47C203MG SOP28-P-450-1.27B TMP47P403VMG *: For the dimensions of the new package, see the attached Package Dimensions diagram. 3. Addition of notes on lead solderability The following solderability test is conducted on the new device. Lead solderability of Pb-free devices (with the G suffix) Test Test Conditions Remark Solderability (1) Use of Lead (Pb) · solder bath temperature = 230°C · dipping time = 5 seconds · the number of times = once · use of R-type flux (2) Use of Lead (Pb)-Free · solder bath temperature = 245°C · dipping time = 5 seconds · the number of times = once · use of R-type flux Leads with over 95% solder coverage till lead forming are acceptable. |
同様の部品番号 - TMP47C103MG |
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同様の説明 - TMP47C103MG |
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