Characteristics

STPS1H100-Y

4/9

Doc ID 17935 Rev 1

Figure 7.

Relative variation of thermal

impedance junction to ambient

versus pulse duration (SMB)

Figure 8.

Relative variation of thermal

impedance junction to ambient

versus pulse duration (SMA)

Z/R

th(j-c)

th(j-c)

0.01

0.10

1.00

1.E-03

1.E-02

1.E-01

1.E+00

1.E+01

1.E+02

1.E+03

Single pulse

SMB

t (s)

p

Z/R

th(j-c)

th(j-c)

0.01

0.10

1.00

1.E-03

1.E-02

1.E-01

1.E+00

1.E+01

1.E+02

1.E+03

Single pulse

SMA

t (s)

p

Figure 9.

Reverse leakage current versus

reverse voltage applied

(typical values)

Figure 10.

Junction capacitance versus

reverse voltage applied

(typical values)

I (µA)

R

1.E-03

1.E-02

1.E-01

1.E+00

1.E+01

1.E+02

1.E+03

0

1020

3040506070

8090

100

T

T

V (V)

R

C(pF)

10

100

1

10

100

F=1 MHz

V

T

V (V)

R

Figure 11.

Forward voltage drop versus

forward current (maximum values)

Figure 12.

Thermal resistance junction to

ambient versus copper surface

under each lead (SMB)

I

(A)

FM

0.01

0.10

1.00

10.00

100.00

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

T

T

V

(V)

FM

R

(°C/W)

th(j-a)

20

30

40

50

60

70

80

90

100

110

120

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

SMB

S(Cu)(cm²)

Epoxy printed circuit board FR4, copper thickness: 35 µm