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AD812 データシート(PDF) 5 Page - Analog Devices |
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AD812 データシート(HTML) 5 Page - Analog Devices |
5 / 16 page AD812 –5– REV. B MAXIMUM POWER DISSIPATION The maximum power that can be safely dissipated by the AD812 is limited by the associated rise in junction temperature. The maximum safe junction temperature for the plastic encap- sulated parts is determined by the glass transition temperature of the plastic, about 150 °C. Exceeding this limit temporarily may cause a shift in parametric performance due to a change in the stresses exerted on the die by the package. Exceeding a junction temperature of 175 °C for an extended period can result in device failure. While the AD812 is internally short circuit protected, this may not be sufficient to guarantee that the maximum junction tem- perature (150 degrees) is not exceeded under all conditions. To ensure proper operation, it is important to observe the derating curves. It must also be noted that in high (noninverting) gain configura- tions (with low values of gain resistor), a high level of input overdrive can result in a large input error current, which may result in a significant power dissipation in the input stage. This power must be included when computing the junction tempera- ture rise due to total internal power. AMBIENT TEMPERATURE – C 2.0 1.5 0 –50 90 –40 –30 –20 –10 0 10 20 30 50 60 70 80 40 1.0 0.5 8-LEAD SOIC PACKAGE 8-LEAD MINI-DIP PACKAGE TJ = +150 C Figure 3. Plot of Maximum Power Dissipation vs. Temperature ABSOLUTE MAXIMUM RATINGS 1 Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±18 V Internal Power Dissipation 2 Plastic (N) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.3 Watts Small Outline (R) . . . . . . . . . . . . . . . . . . . . . . . . . . 0.9 Watts Input Voltage (Common Mode) . . . . . . . . . . . . . . . . . . . . ±V S Differential Input Voltage . . . . . . . . . . . . . . . . . . . . . . . ±1.2 V Output Short Circuit Duration . . . . . . . . . . . . . . . . . . . . . . Observe Power Derating Curves Storage Temperature Range N, R . . . . . . . . . –65 °C to +125°C Operating Temperature Range . . . . . . . . . . . . –40 °C to +85°C Lead Temperature Range (Soldering, 10 sec) . . . . . . . +300 °C NOTES 1Stresses above those listed under Absolute Maximum Ratings may cause perma- nent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. 2Specification is for device in free air: 8-lead plastic package: θ JA = 90°C/Watt; 8-lead SOIC package: θ JA = 150°C/Watt. ORDERING GUIDE Temperature Package Package Model Range Description Option AD812AN –40 °C to +85°C 8-Lead Plastic DIP N-8 AD812AR –40 °C to +85°C 8-Lead Plastic SOIC SO-8 AD812AR-REEL 13" Reel AD812AR-REEL7 7" Reel METALIZATION PHOTO Dimensions shown in inches and (mm). V+ 8 OUT2 7 –IN2 6 2 –IN1 3 +IN1 4 V– 1 OUT1 5 +IN2 4 V– 0.0783 (1.99) 0.0539 (1.37) CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the AD812 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. WARNING! ESD SENSITIVE DEVICE |
同様の部品番号 - AD812 |
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同様の説明 - AD812 |
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