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FOD8160 データシート(PDF) 4 Page - Fairchild Semiconductor |
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FOD8160 データシート(HTML) 4 Page - Fairchild Semiconductor |
4 / 15 page ©2012 Fairchild Semiconductor Corporation www.fairchildsemi.com FOD8160 Rev. 1.0.1 4 Absolute Maximum Ratings Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings are stress ratings only. TA = 25°C unless otherwise specified. Note: 1. No derating required up to 100°C. Recommended Operating Conditions The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not recommend exceeding them or designing to absolute maximum ratings. Note: 2. 0.1 µF bypass capacitor must be connected between pins 4 and 6. Symbol Parameter Value Units TSTG Storage Temperature -40 to +125 °C TOPR Operating Temperature -40 to +100 °C TJ Junction Temperature -40 to +125 °C TSOL Lead Solder Temperature (Refer to Reflow Temperature Profile on page 12) 260 for 10 sec °C Input Characteristics IF Average Forward Input Current 25 mA VR Reverse Input Voltage 5.0 V PDI Input Power Dissipation(1) 45 mW Output Characteristics VCC Supply Voltage 0 to 7.0 V VO Output Voltage -0.5 to VCC + 0.5 V IO Average Output Current 50 mA PDO Output Power Dissipation(1) 85 mW Symbol Parameter Min. Max. Unit TA Ambient Operating Temperature -40 +100 ºC VCC Supply Voltages(2) 3.0 5.5 V VFL Logic Low Input Voltage 0 0.8 V IFL Logic Low Input Current 250 µA IFH Logic High Input Current 6.0 15 mA N Fan Out (at RL = 1 kΩ) 5 TTL loads RL Output Pull-up Resistor 330 4,000 Ω |
同様の部品番号 - FOD8160 |
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同様の説明 - FOD8160 |
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