REV. 0

ADF4110/ADF4111/ADF4112/ADF4113

–4–

CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumu-

late on the human body and test equipment and can discharge without detection. Although the

ADF4110/ADF4111/ADF4112/ADF4113 features proprietary ESD protection circuitry, permanent

damage may occur on devices subjected to high-energy electrostatic discharges. Therefore, proper ESD

precautions are recommended to avoid performance degradation or loss of functionality.

WARNING!

ESD SENSITIVE DEVICE

ABSOLUTE MAXIMUM RATINGS

1, 2

°C unless otherwise noted)

3

. . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V

Operating Temperature Range

Industrial (B Version) . . . . . . . . . . . . . . .

–40

°C to +85°C

Storage Temperature Range . . . . . . . . . . . . –65

°C to +150°C

Maximum Junction Temperature . . . . . . . . . . . . . . . . 150

°C

TSSOP

CSP

CSP

(Paddle Not Soldered) . . . . . . . . . . . . . . . . . . . . . 216

°C/W

Lead Temperature, Soldering

Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . 215

°C

Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 220

°C

NOTES

nent damage to the device. This is a stress rating only; functional operation of the

device at these or any other conditions above those listed in the operational

sections of this specification is not implied. Exposure to absolute maximum rating

conditions for extended periods may affect device reliability.

< 2 kV and it is ESD sensitive. Proper precautions should be taken for handling

and assembly.

TRANSISTOR COUNT

6425 (CMOS) and 303 (Bipolar).

ORDERING GUIDE

Model

Temperature Range

Package Description

Package Option

*

ADF4110BRU

–40

°C to +85°C

Thin Shrink Small Outline Package (TSSOP)

RU-16

ADF4110BCP

–40

°C to +85°C

Chip Scale Package (CSP)

CP-20

ADF4111BRU

–40

°C to +85°C

Thin Shrink Small Outline Package (TSSOP)

RU-16

ADF4111BCP

–40

°C to +85°C

Chip Scale Package (CSP)

CP-20

ADF4112BRU

–40

°C to +85°C

Thin Shrink Small Outline Package (TSSOP)

RU-16

ADF4112BCP

–40

°C to +85°C

Chip Scale Package (CSP)

CP-20

ADF4113BRU

–40

°C to +85°C

Thin Shrink Small Outline Package (TSSOP)

RU-16

ADF4113BCP

–40

°C to +85°C

Chip Scale Package (CSP)

CP-20

ADF4113BCHIPS

–40

°C to +85°C

DICE

DICE

*Contact the factory for chip availability.

CLOCK

DATA

LE

LE

DB20 (MSB)

DB19

DB2

DB1

(CONTROL BIT C2)

DB0 (LSB)

(CONTROL BIT C1)

Figure 1. Timing Diagram